Denka Company Limited

Yoshitaka Minakata

Saori Inoue

Toshitaka Yamagata

Ryuji Koga

Ryo Yoshimatu

Ryo Yoshimatsu

Eri Sasaki

Tomoya Yamaguchi

Mana Oki

A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.

Temporary bonding body of ceramic resin composite and metal plate, method for producing same, object to be transported including the temporary bonding body, and method for transporting same

One aspect of the present invention provides a composite sheet which comprises a nitride sintered body having a porous structure and a semi-cured product of a thermosetting resin composition impregnated into the nitride sintered body, the line roughness Rz specified by JIS B 0601:2013 of at least one main surface being 10 μm or less.

Composite sheet and method for manufacturing same, and laminate and method for manufacturing same

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

Nitride ceramic resin composite body

A thermal conductive member includes: first and second surface layers including an insulating material A, and an intermediate layer including an insulating material B. The insulating material A includes a first boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.6 to 1.4, and a first heat curable resin composition impregnating in the first boron nitride sintered body. The insulating material B includes a second boron nitride sintered body having an orientation degree of hexagonal boron nitride primary particles of 0.01 to 0.05, and a second heat curable resin composition impregnating in the second boron nitride sintered body.

Growing community of inventors

Omuta, Japan

Yoshitaka Minakata