Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi Ulsi Engineering Corp.

Other

Vlsi Engineering Corporation

Yoshitaka Kinoshita

Kazumasa Yanagisawa

Yutaka Kobayashi

Goro Kitsukawa

Hitoshi Miwa

Atsushi Nozoe

Masayuki Nakamura

Tetsurou Matsumoto

Shoji Wada

Tetsu Udagawa

Kyoko Ishii

Hideaki Nakamura

Tatsuyuki Ohta

Yukio Kawashima

Hiromi Tsukada

Yoshiaki Ouchi

Kazuo Mihashi

Atsushi Nakamura

Masayasu Kawamura

Yasushi Takahashi

Yoshihiko Inoue

Kenji Nishimoto

Yoshihiro Sakaguchi

Masakazu Aoki

Kazuyuki Miyazawa

Hiromasa Noda

Hitoshi Tanaka

Hidetoshi Iwai

Masaya Muranaka

Satoru Koshiba

Two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units. A memory module is so constructed that a plurality of such semiconductor storage devices, in each of which two memory chips each being subjected to memory accesses in 2-bit units are assembled into a stacked structure by placing their back surfaces one over the other, so as to make memory accesses in 4-bit units, are mounted on a mounting circuit board which is square and which is formed with electrodes along one latus thereof.

Semiconductor storage device having memory chips in a stacked structure

Semiconductor device and memory module

A bootstrap circuit is provided for a word line selector for setting word lines connected with dynamic memory cells at a select level corresponding to a first voltage and a nonselect level corresponding to a second voltage. The bootstrap circuit generates a bootstrap voltage which is given a difference substantially equal to the threshold voltage of address select MOSFETs with respect to the high level of bit lines connected with the memory cells, and feeds the bootstrap voltage to the selected word lines. The bootstrap circuit is activated in synchronism with a clock signal at a timing corresponding to an action mode designated by a command in an SDRAM before a precharge action, thereby changing the select level of the word lines from the first voltage to the bootstrap voltage.

Dynamic RAM having word line voltage intermittently boosted in

An X address buffer for generating an internal address signal by capturing an X address signal input from an address terminal is brought into an operating state before an external control clock is input. A redundancy address comparator for detecting a match/mismatch signal by comparing the generated internal address signal with a stored X-system defective address is used as a static circuit. Thereby, the redundancy address comparator starting operation is accelerated and as a result, acceleration of the reading operation is achieved.

Dynamic RAM provided with a defect relief circuit

Between an external terminal and the gate of one of output MOSFETs whose source or drain is connected to the external terminal, there is connected a P-channel type first protective MOSFET whose gate is connected to a high voltage side power supply terminal and which has a channel length equal to or larger than that of the output MOSFET, or an N-channel type second protective MOSFET whose gate is connected to a low voltage side power supply terminal and which has a channel length equal to or larger then that of the output MOSFET. When the external terminal is discharged by device charge, one of the protective MOSFETs is turned on, and the charge on the gate side of the output MOSFET can be likewise released by device charge to prevent ESD (Electro-Static Discharge) breakdown.

Semiconductor device

A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as current signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.

Dynamic Random Access Type Semiconductor Device

According to one aspect of the present invention, a semiconductor chip, which can be mounted in a zigzag in-line type package (ZIP) partially using a tabless lead frame, includes bonding pads arranged on the chip so that the chip can be applied also to other different types of packages. These different types of packages include a small out-line J-bent type package (SOJ) which uses a lead frame with tab, and a dual in-line type package (DIP) which uses a tabless lead frame. Further, a plurality of bonding pad pairs are provided amongst the bonding pads on the chip, each pad of such bonding pad pairs having the same function as the other pad associated therewith thereby duplicating a common function in different bonding pads on the semiconductor chip so as to make the semiconductor chip compatible with a variety of or different types of packages. In accordance with another aspect of the invention, a resin-encapsulated semiconductor device of the ZIP structure is provided in which a semiconductor pellet having a plurality of external terminals disposed on a device-forming surface along each side of the planar shape is encapsulated with a resin, wherein inner leads for signals connected electrically with external terminals, disposed opposing to the surface of the resin-encapsulated portion disposed with outer leads and disposed along the most remote side of the semiconductor pellet, are arranged so as to overlap the semiconductor pellet.

Resin-encapsulated semiconductor memory device useful for single in-line

Testing method for a semiconductor memory device

A Bi.CMOS semiconductor memory device is provided which includes an arrangement to simultaneously select a plurality of memory cells, followed by using a 3 bit Z addressing arrangement to determine a read or write operation for the simultaneously selected memory cells. To speed up the word line selection, a static selection type operation is used with the word line selecting voltage being greater than signal amplitude of the data lines during the write operation. Also, to speed up the read operation, separate common I/O lines are provided for the read and write operations. Read signals are transmitted as curent signals, and then converted to voltage signals for improving reading speed. Also, improved arrangements are provided for resistance structure, logic circuitry, input circuitry, fuse cutting circuitry, drive circuitry, power circuitry, electrostatic protection circuitry, layout structure and testing methods for the semiconductor device.

Bi-CMOS semiconductor memory device, including improved layout structure

Growing community of inventors

Akishima, Japan

Yoshitaka Kinoshita