Mitsubishi Electric Corporation

Ricoh Company, Ltd.

Mitsubishi Hitachi Power Systems Environmental Solutions, Ltd.

Nippon Steel & Sumitomo Metal Corporation

Smk Corporation

Pentax Ricoh Imaging Company, Ltd.

Ricoh Imaging Company, Ltd.

Showa Denko K.k.

Showa Denko Kabushiki Kaisha

Mitsubishi Heavy Industries Mechatronics Systems, Ltd.

Nippon Steel Corporation

Yoshitaka Kimura

Rei Yoneyama

Akihiko Yamashita

Ryo Goto

Akira Goto

Mariko Ono

Takehiro Araki

Hideo Suzuki

Yoshio Kuromi

Takahiro Suzuki

Naoto Asakura

Teruyuki Takei

Yoshitaka Otsubo

Hidetoshi Ishibashi

Keisuke Eguchi

Kenji Hatano

Minoru Egusa

Hajime Onozawa

Hiroyuki Tanaka

Takeshi Matsuda

Kosei Kosako

Yuji Furuta

Masayuki Ando

Katsuhiko Okitsu

Seiichi Terakura

Shinsuke Asada

Minoru Genta

Toshihiro Amei

Takami Otsuki

Tadashi Hiraiwa

Tatsuo Kato

Haruhiko Murakami

Nobuchika Aoki

Kunihiro Miyazaki

Masaji Komuro

Kenji Nakazawa

Nobuhiro Asaji

Taku Akaiwa

Susumu Shinozaki

Kazunari Teshigawara

Takayuki Shirahama

A power semiconductor device includes: a power semiconductor element; a control circuit that controls the power semiconductor element; a control substrate having the control circuit mounted thereon; a lid arranged to overlap with at least a portion of the control substrate in a first direction; and at least one external connection terminal having a first portion connected with the control substrate, a second portion to be connected with an external apparatus, and a third portion located between the first portion and the second portion and fixed to the lid, the first portion being constituted as a press-fit portion.

Power semiconductor device including press-fit connection terminal

A semiconductor module includes: a dissipating metal plate including a recess provided on an upper surface; an insulating substrate provided on a bottom surface of the recess and including a circuit pattern; a semiconductor device provided on the insulating substrate and connected to the circuit pattern; a case bonded to a peripheral portion on the upper surface of the dissipating metal plate and surrounding the insulating substrate and the semiconductor device; a case electrode provided on the case; a wire connecting the semiconductor device and the case electrode; and a sealant provided in the case and sealing the insulating substrate, the semiconductor device, and the wire, wherein a sidewall of the recess has a taper.

Semiconductor module

An electronic device electrically connectable to an external device includes: circuitry configured to: accept, from a user, a selection of one of: a first state that enables the electronic device to supply electric power to the external device; and a second state that enables the electronic device to receive electric power from the external device; and switch a state of the electronic device to the selected one of the first state and the second state and fix the selected one of the first state and the second state as the state of the electronic device in response to power off of the electronic device.

Electronic device and method executed by the electronic device

A power supply device includes a battery and processing circuitry. The processing circuitry is configured to estimate a tendency of consumption of the battery and put the power supply device into one of a first state in which the power supply device can supply electric power to another device and a second state in which the power supply device can receive electric power from said another device, in accordance with the tendency of consumption of the battery estimated.

Power supply device

An electronic device includes a power supply and a power supply circuit. The power supply circuit is configured to alternately switch a state of the electronic device between a first state to supply power to another device and a second state to receive power from said another device, and stop a switching operation of the state of the electronic device when the electronic device is off, to fix the state of the electronic device to one of the first state and the second state.

Electronic device including power supply and method to be executed by electronic device including power supply

A semiconductor module includes: a base plate; a semiconductor chip on the base plate; a case surrounding the semiconductor chip on the base plate, and sealing resin sealing the semiconductor chip inside the case, wherein a linear expansion coefficient of the sealing resin increases continuously from the semiconductor chip toward an upper surface of the sealing resin.

Semiconductor module, method for manufacturing the same, and power conversion device

An electronic device includes a power supply, a connector, a detector, and a switch. The connector is configured to be alternatively connectable in a first direction and in a second direction. The detector is configured to detect which of the first direction and the second direction the connector has been connected in. The switch is configured to switch a state of the electronic device between a first state to supply power to another device and to a second state to receive power from said another device. The switch is configured to switch the state of the electronic device to the first state or the second state according to a connection direction of the connector detected by the detector.

Electronic device including power supply and method to be executed by electronic device

An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.

Electrode terminal, semiconductor device, and power conversion apparatus

A base plate includes a heat dissipation metal plate and a resin insulating layer. The resin insulating layer is formed on the heat dissipation metal plate. The resin insulating layer is provided with a notch where part of the heat dissipation metal plate is exposed. A case is bonded to an exposure part being part of the heat dissipation metal plate by means of a bonding agent.

Semiconductor device

There is provided a power information management device communicable with at least one another device and being able to perform one of mutual power supply and unidirectional power supply, comprising: a requesting unit configured to send a request for information concerning electric power to the at least one another device; a receiving unit configured to receive the power information from the at least one another device which has received the request; and a generating unit configured to generate power information concerning electric power of a plurality of devices including the power information management device and the at least one another device based on the information received from the at least one another device.

Power information management device and power information management system

According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal including a first connection portion extending to a top surface of the case, and a second connection portion provided on the top surface of the case and a control substrate provided on the second connection portion, wherein the first connection portion is connected to the semiconductor device, the second connection portion includes a first end connected to an end of the first connection portion, and a second end opposite to the first end, the second connection portion being a flat plate and having an elastic force using the first end as a supporting point, the second end contacts the control substrate with an elastic force, and the second connection portion has a constriction structure having a notch formed in a side surface along a longitudinal direction.

Semiconductor apparatus

An apparatus for imaging an object is equipped with an image sensor comprising a plurality of pixels; a charge-reading processor that reads out accumulated charges in a given pixel via a pixel circuit of the charge accumulated pixel; and a noise-reading processor that reads out noise signals from a pixel circuit for a given pixel. The noise-reading processor reads noise signals from a pixel circuit for a pixel that is an object of noise acquisition, in parallel with the reading of accumulated charges by the charge-reading processor.

Method and apparatus for imaging an object

A semiconductor device includes an insulating substrate, a semiconductor element provided on the insulating substrate, a case frame, a press-fit terminal, and a sealing member provided on an inner side of an inner wall part on the insulating substrate to seal the semiconductor element. The case frame is made of an insulating material and includes an outer wall part, an inner wall part, a recess bottom surface forming a recess together with the outer wall part and the inner wall part. The press-fit terminal includes a base part, a body part, and a press-in portion. The base part is embedded in the recess bottom surface and the body part stands upright from the recess bottom surface such that the body part extends between the inner wall part and the outer wall part, and the press-in portion protrudes up out of the recess.

Semiconductor device having press-fit terminals disposed in recesses in a case frame

A semiconductor device includes: a base plate including a metallic base plate and an insulating film provided on the metallic base plate; a semiconductor chip provided on the base plate; a control board disposed above the semiconductor chip; and a relay terminal connected to a signal electrode of the semiconductor chip through a signal line wire, extending to the control board, and connected to the control board, wherein the relay terminal is directly fixed to the insulating film of the base plate.

Semiconductor device and electric power conversion device having relay terminal directly fixed to an insulating film of base plate

A semiconductor device includes a base plate, a case, a power semiconductor element, and a control semiconductor element. Case is provided on base plate. Power semiconductor element is disposed over base plate in case. Control semiconductor element is disposed in case. Case has an opening formed therein opposite to base plate. The semiconductor device further includes a cover to close opening in case. Cover has a hole formed in at least a portion of a region overlapping control semiconductor element in plan view.

Semiconductor device having improved heat dissipation efficiency

Growing community of inventors

Tokyo, Japan

Yoshitaka Kimura