Canon Kabushiki Kaisha

Yoshitaka Kawase

Yasuhiko Sano

Satoshi Sugimoto

An image pickup module includes a first base body, a pixel portion, a first conductive pattern, a second base body, a second conductive pattern, and a conductor portion. The pixel portion is provided in the first base body and includes a plurality of pixels arranged in a first direction and a second direction. The first conductive pattern is provided in the first base body. The first base body is provided on the second base body. The second conductive pattern is provided in the second base body and electrically connected to the first conductive pattern via a first connection conductor portion and a second connection conductor portion. A loop structure including the first conductive pattern, the second conductive pattern, the first connection conductor portion, and the second connection conductor portion is formed as viewed in the first direction. The conductor portion is connected in parallel to the first conductive pattern.

Image pickup module, image pickup apparatus, and electronic device

An interposer of a first semiconductor package includes a power supply wiring for a second semiconductor element, the power supply wiring including a land provided in one surface layer, and a power supply pattern provided in an inner layer and electrically connected to the land, the power supply wiring further including a larger number of lands than the land, which are provided in another surface layer and electrically connected in parallel to the power supply pattern. In a stacked semiconductor device, this configuration can improve the quality of power supply to the second semiconductor element to secure signal processing operation while preventing an increase in inductance caused by the bending of a power supply path in a power supply wiring of a printed wiring board or by a deviation of connection intervals.

Stacked semiconductor device and printed circuit board

A pad for a line which supplies an electric power potential is disposed on a semiconductor integrated circuit and a pad which is not electrically connected to any other electric circuit is disposed on a semiconductor integrated circuit board, and the two pads are connected through a bonding wire. An LC resonant circuit is configured with ease using a floating capacitance C of the pad which is in an electrically open state and which is disposed in a vacant region and an inductance value L of the bonding wire which is disposed in a three-dimensional manner. High-frequency noise is filtered and high-density implementation is realized.

Growing community of inventors

Yokohama, Japan

Yoshitaka Kawase