Kabushiki Kaisha Toshiba

Dai Nippon Printing Co., Ltd.

Adeia Semiconductor Bonding Technologies Inc.

Tessera Interconnect Materials, Inc.

D.t. Circuit Technology Co., Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Yoshitaka Fukuoka

Osamu Shimada

Hiroyuki Hirai

Yuji Yamaguchi

Kenji Sasaoka

Tomoo Iijima

Hiroshi Yagi

Tomohisa Motomura

Kenichi Matsumura

Tooru Serizawa

Kazuhiro Shinozaki

Satoshi Shibazaki

Tatsuro Imamura

Satoru Kuramochi

Kazuhiro Matsumoto

Jun Hanari

Takeshi Miyagi

Akira Ogawa

Akihiko Takagi

Minoru Nii

Ayako Tohdake

Toshiaki Komine

An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.

Multilayer wiring board for an electronic device

An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.

Electronic component built-in wiring board and method for radiating heat generated at the same

An object is to provide an electronic device of a multilayer structure with high density and high reliability that can be reduced in size while incorporating an electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring layers and electrically insulating layers stacked on a core board and establishes predetermined electrical conduction between the wiring layers through upper-lower side conducting vias provided in the electrically insulating layers. An electronic component incorporating layer formed by directly forming a lower layer and insulating resin layer having a cutout portion for receiving an electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and/or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic incorporating layers has a metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a metal cap having a flange portion fixed to the metal frame body of the uppermost-layer electronic component incorporating layer is provided.

Electronic device and production method thereof

An object is to provide an electronic device of a multilayer structure with high density and high reliability that can be reduced in size while incorporating an electronic component therein, and further provide a production method for easily producing such an electronic device. An electronic device of the present invention includes wiring layers and electrically insulating layers stacked on a core board and establishes predetermined electrical conduction between the wiring layers through upper-lower side conducting vias provided in the electrically insulating layers. An electronic component incorporating layer formed by directly forming on a lower layer an insulating resin layer having a cutout portion for receiving an electronic component therein and upper-lower side conducting vias and by incorporating the electronic component in the cutout portion is provided at least between one of the wiring layers and one of the electrically insulating layers and/or between the core board and the electrically insulating layer. At least the uppermost-layer electronic component incorporating layer of electronic component incorporating layers has a metal frame body surrounding the electronic component and the upper-lower side conducting vias, and a metal cap having a flange portion fixed to the metal frame body of the uppermost-layer electronic component incorporating layer is provided.

A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.

Method for fabricating wiring board provided with passive element, and wiring board provided with passive element

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

Component built-in wiring board and manufacturing method of component built-in wiring board

A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned metal wiring film extending along a second major surface thereof. The wiring board includes solid metal interconnects connecting the first patterned metal wiring film to the second patterned metal wiring film, the interconnects extending through at least one of the first and second insulating films, and a microelectronic element disposed between the first and second patterned wiring films, the microelectronic element having bond pads conductively connected to the first patterned metal wiring films. The wiring board also includes a plurality of external contacts exposed at one or more external surfaces of the multilayer wiring board, the contacts being conductively connected to at least one of the first and second patterned metal wiring films.

To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating reliability. The component built-in wiring board includes: a conductive layer () extending in a thickness direction of the board and buried in the board without being exposed from an upper and a lower surface of the board; an electrical/electronic component () having a terminal and buried in the board with the terminal facing the buried conductive layer; a connecting member () provided in a gap between the terminal of the buried electrical/electronic component and the conductive layer to electrically/mechanically connect the terminal and the conductive layer; and two upper and lower insulating layers () which cover an outer surface of the buried electrical/electronic component excluding a portion connected to the connecting member and which are in close contact with a top and a bottom in the board thickness direction of the electrical/electronic component.

To provide a multilayer wiring board mainly used for an electronic device, in which a bump passing through an interlayer insulating film allows for interlayer connection between plural wiring films insulated from one another with plural interlayer insulating layers. In the multilayer wiring board, a circuit element such as an electronic part, a semiconductor chip, or a passive element is accommodated in the interlayer insulating films so as to connect its terminal with the corresponding wiring film. In particular, the semiconductor chip is polished to a thickness of 50 &#x3bc;m or smaller, and the multilayer wiring board itself for the electronic device has the flexibility.

Wiring board incorporating components and process for producing the same

Method for fabricating wiring board provided with passive element

Wiring board provided with passive element and cone shaped bumps

A manufacturing method of a printed wiring board. On a conductor plate approximately conical conductor bumps . . . are formed, the conductor bumps . . . being caused to penetrate through a prepreg to project tip ends of the conductor bumps . . . from an opposite side of the prepreg The tip ends of the conductor bumps . . . and interconnection patterns and on surfaces of core material A, before bonding, are exposed to plasma to activate. The activated tip ends of the conductor bump . . . and interconnection patterns and on the surface of the core material are stacked to bond both.

Printed wiring board with plurality of interconnect patterns and conductor bumps

In order to obtain a semiconductor device of which bonding reliability between a semiconductor element and a printed wiring board is improved and a manufacturing method thereof, in a semiconductor device mounted a semiconductor element on a printed wiring board , while a circumference of a metal bump formed on a conductor pad electrode disposed on the printed wiring board in wiring pattern and an electrode disposed along an external periphery of a semiconductor element facing the metal bump is provided with, along a placement position of the metal bump or the electrode , frame- or wall-shaped anisotropic conductive film , a gap between the semiconductor element and the printed wiring board , the insides of the anisotropic conductive film formed in frame or wall shape, is filled by sealing material such as epoxy resin or the like.

Growing community of inventors

Tokyo, Japan

Yoshitaka Fukuoka