Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Yoshitaka Etoh

Satoshi Shida

Hiroshi Haji

Shinji Kanayama

Shoriki Narita

Shuichi Hirata

Shunji Onobori

Akira Kugihara

Mamoru Nakao

Kunio Oe

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting apparatus

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting method

Growing community of inventors

Katano, Japan

Yoshitaka Etoh