Murata Manufacturing Co., Ltd.

Yoshitaka Echikawa

Issei Yamamoto

Takafumi Kusuyama

Ikuo Deguchi

Tadashi Nomura

Akio Katsube

Yoichi Takagi

Yoshitaka Matsukawa

A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.

Mountable electronic component and electronic circuit module

A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

Substrate with antenna, and antenna module

A substrate equipped with an antenna of the present disclosure includes a circuit substrate and an antenna element. When viewed from a thickness direction, an area of one principal surface of the circuit substrate is larger than that of another principal surface thereof, and each of the one principal surface and the other principal surface of the circuit substrate is formed in a rectangular shape. When a maximum width between a first outer periphery of the other principal surface projected onto the one principal surface and a first outer periphery of the one principal surface is defined as W, the antenna element is mounted in at least part of a region on the one principal surface of the circuit substrate, in which the region has the width Wfrom the second outer periphery of the other principal surface projected onto the one principal surface toward the inner side.

Substrate equipped with antenna and antenna module

An electronic component package () includes a resin layer (), an electronic component (), a grounding member (), and a conductor film (). The grounding member () includes a multilayer body () and an outer conductor () disposed at an end portion of the multilayer body () in a lamination direction. The multilayer body () includes at least one resin film () and at least one pattern conductor () laminated one on another, and at least one via conductor () extending in the lamination direction and connected to the outer conductor (). In the multilayer body (), at least one of the pattern conductor () has at least part of a circumference connected to a conductor film () and electrically connected to the via conductor (). Part of an external terminal and part of the outer conductor () are exposed from an identical surface of the resin layer ().

Electronic component package and method for manufacturing the same

A radio-frequency moduleincludes a wiring board, a first componentmounted on a lower surfaceof the wiring board, a plurality of connection terminals, a first sealing resin layerthat covers the first componentand the connection terminals, a plurality of second componentsmounted on an upper surfaceof the wiring board, a second sealing resin layerthat covers the second components, and a shield film. By adjusting surface roughness of a lower surfaceof the first sealing resin layer, surface roughness of a lower surfaceof the first component, and surface roughness of a lower surfaceof the connection terminal, it is possible to prevent abnormal deposition of plating and a crack in the first component, and to prevent malfunction of the radio-frequency module

Growing community of inventors

Kyoto, Japan

Yoshitaka Echikawa