Shin-etsu Chemical Co., Ltd.

National Institute for Materials Science

Yoshitaka Aoki

Kunihiko Mita

Tsutomu Yoneyama

Hidehiko Tanaka

Hironao Fujiki

Tetsuo Nakanishi

Kunihiro Yamada

Akinari Itagaki

Kazuhiko Tomaru

Kazuyuki Taniguchi

Yoshiyasu Yamada

Hiroaki Tetsuka

A negative electrode active material for a non-aqueous electrolyte secondary battery, wherein the negative electrode active material is represented by an elemental composition formula of Met-Si&#x2014;O&#x2014;C&#x2014;H (wherein Metrepresents one alkali metal element or a mixture of alkali metal elements), including: a silicate salt made of a silicon-based inorganic compound and the alkali metal, and fine particles composed of silicon, silicon alloy, or silicon oxide being dispersed in the silicate salt; and a negative electrode active material for a non-aqueous electrolyte secondary battery, wherein the negative electrode active material is represented by an elemental composition formula of Met-Si&#x2014;O&#x2014;C&#x2014;H (wherein Metrepresents one alkaline earth metal element or a mixture of alkaline earth metal elements), including: a silicate salt made of a silicon-based inorganic compound and the alkaline earth metal.

Negative electrode active material for non-aqueous electolyte secondary battery and method of producing the same

A method of producing silicon carbide is provided. The method includes heating a cured product of a curable silicone composition in a non-oxidizing atmosphere at a temperature exceeding 1,500&#xb0; C. but not more than 2,600&#xb0; C. The method is capable of producing high-purity silicon carbide simply and at a high degree of productivity, and is capable of simply producing a silicon carbide molded item having a desired shape and dimensions.

Method of producing silicon carbide

An amorphous inorganic ceramic material including silicon, carbon and oxygen is provided. In the ceramic material, the average elemental ratio between silicon, carbon and oxygen is represented by a compositional formula:SiCOwherein, a is a number that satisfies: 0.5&#x2266;a&#x2266;3.0, and b is a number that satisfies 0.5&#x2266;b&#x2266;4.0), the material has a siloxane skeleton formed of Si&#x2014;O&#x2014;Si bonds, and the hydrogen mass fraction is within a range from 0 to 1% by mass. The material exhibits excellent heat resistance, wettability with other materials, strength and elastic modulus, and is useful as a reinforcing material for composite materials, or as an exhaust gas filter material or the like.

Amorphous inorganic ceramic material and method of producing same

A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Heat dissipating member

A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.

Heat conductive composite sheet and process for producing same

A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &#x3bc;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &#x3bc;m. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250&#xb0; C. and a particle diameter of 0.1-100 &#x3bc;m, together with a thermally-conducting powder (2) having a melting temperature exceeding 250&#xb0; C. and an average particle diameter of 0.1-100 &#x3bc;m, such that (1)/[(1)+(2)]=0.2-1.0.

Heat-dissipating member, manufacturing method and installation method

An antifoaming composition contains (A) 58 to 90% by weight of an oil compound and (B) 10 to 42% by weight of a mixture. The oil compound (A) consisting essentially of (i) 80 to 99.9% by weight of an organopolysiloxane composed of R SiO , R SiO and R SiO units in a ratio of (0.1 to 5):(90 to 99.8):(0.1 to 5) by mol % and (ii) 0.1 to 20% by weight of finely divided silica. The mixture (B) consisting essentially of (iii) 30 to 90% by weight of a polyoxyalkylene-modified silicone oil having a viscosity of 120,000 to 1,000,000 centipoise at 25&deg; C. and (iv) 1 to 70% by weight of a polyhydric alcohol alkyl ether having a molecular weight of 50 to 300. The composition has improved antifoaming properties, water dispersibility and stability.

Antifoaming compositions

A method of producing a branched silicone oil which comprises mixing 100 parts by weight of an organopolysiloxane represented by the following formula (I) and/or an organopolysiloxane represented by the following formula (II) with 0.1 to 100 parts by weight of an organopolysiloxane represented by the following formula (III) and causing these oranopolysiloxanes to undergo condensation and equilibration reactions by heating them in the presence of basic catalysts:

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Takasaki, Japan

Yoshitaka Aoki