Nitto-denko Corporation

Nitto Electric Industrial Co., Ltd.

Yoshitada Morikawa

Miho Yamaguchi

Yasuo Yamamoto

Mitsuyoshi Shirai

Yoshiaki Mitsuoka

Mitsuo Yoshihara

Masaaki Hattori

Mitsuharu Komada

Michio Komoto

Osamu Oohira

Yuichi Inoue

Masayuki Konno

Seishi Suzuki

Kotaro Shimobayashi

Hideo Satou

Kodo Kishida

To provide a pressure-sensitive adhesive component that can be quickly and easily used to fix an ankle joint by persons having no expert knowledge on taping without causing problems such as difficulty in wearing shoes due to thickening upon application of the tape, a pressure-sensitive adhesive component includes a bottom portion; a first tape-shaped body; and a second tape-shaped body, wherein a cut is provided between the first and second tape-shaped bodies running in a longitudinal direction, the first tape-shaped body including a first front tape body and a first rear tape body, and the second tape-shaped body including a second front tape body and a second rear tape body, and wherein a ratio of a width of the front tape body to a width of the rear tape body is within the range of 5:5 to 5:3.

Pressure-sensitive adhesive component for ankle and use thereof

A pressure-sensitive adhesive tape for fixing a joint portion includes a support of a generally rectangular shape having a longer side and a shorter side and a pressure sensitive adhesive layer on one side of the support in at least a portion thereof. The support is provided with a non-adherent portion or a weakly adherent portion. The tape has a cut line extending from an end of the shorter side to near the non-adherent or weakly adherent portion.

Pressure-sensitive adhesive tape for fixing a joint portion and method of using the same

A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability. (III) A metal hydroxide represented by the following general formula (1):

Thermosetting resin composition for semiconductor devices

Semiconductor device

An optical fiber coated with a reinforcing material having an excellent heat resistance and a process for producing the same are disclosed. The reinforcing material comprises continuous filaments having impregnated therein a curable composition comprising

Fiber reinforced resin coated optical fiber and process for producing

A reinforced plastic molding having excellent heat resistance, toughness and adhesion property to a fibrous substrate is disclosed, comprising a fibrous substrate having impregnated and cured therein a curable composition comprising tri(meth)acrylate of trishydroxyalkyl isocyanurate, a modified phenol novolak-based epoxy resin and a polymerization initiator.

Reinforced plastic molding

Growing community of inventors

Osaka, Japan

Yoshitada Morikawa