Sumitomo Electric Industries, Limited

Yoshisumi Kawabata

So Tanaka

Hirotaka Oomori

Tatsushi Kaneda

A semiconductor device includes: a base plate having a first surface and having a first contact area in the first surface; a metal plate having a second surface, disposed such that the second surface faces the first surface, and having a second contact area in the second surface; a bonding material disposed between the first surface and the second surface and in contact with the first contact area and the second contact area to bond the metal plate and the base plate; an insulating plate disposed on the metal plate; a circuit member disposed on the insulating plate; a semiconductor element mounted to the circuit member; and a sealing material that covers the metal plate, the bonding material, the insulating plate, the circuit member, and the semiconductor element to seal a space above the base plate, wherein outside the second contact area, the second surface has a non-contact area that is not in contact with the bonding material, wherein on the base plate, a groove portion facing the non-contact area and surrounding the first contact area is provided, and wherein, in a plan view as viewed in a thickness direction of the base plate, an inner periphery of a corner portion of the groove portion has a first curve.

Semiconductor device

A semiconductor device includes a die pad, and a first lead integrally connected to the die pad. A second lead is arranged laterally away from the first lead. A third lead is arranged laterally away from the first lead. A semiconductor element including a first lateral surface and a second lateral surface adjacent to each other, and a third lateral surface adjacent to the second lateral surface is mounted on the die pad such that the first lateral surface faces an end of the second lead and such that the second lateral surface faces an end of the third lead. A main electrode pad and a control electrode pad are provided. First conductive members electrically connect the main electrode pad to the end of the second lead. A second conductive member connects the control electrode pad to the end of the third lead.

A semiconductor device includes a die pad, and a first lead integrally connected to the die pad. A second lead and a third lead are arranged laterally away from the first lead. A semiconductor element including a first lateral surface and a second lateral surface adjacent to each other and a third lateral surface located opposite to the first lateral surface and adjacent to the second lateral surface, is mounted on the die pad. A plurality of first conductive members electrically connects the at least part of a main electrode pad to the end on the die pad side of the second lead. A second conductive member connects a control electrode pad to the end on the die pad side of the third lead.

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Osaka, Japan

Yoshisumi Kawabata