Sumitomo Electric Industries, Limited

Honda Giken Kogyo Kabushiki Kaisha

Other

Japan Science and Technology Corporation

Japan Atomic Energy Research Institute

Yoshishige Takano

Katsuyoshi Kondoh

Toshihiko Kaji

Yoshinobu Takeda

Yugaku Abe

Masaya Miyake

Hiroyuki Horimura

Kenji Okamoto

Yoshiyuki Hirose

Akira Fukui

Takatoshi Takikawa

Masahiko Minemi

Shinichi Yamagata

Makoto Imamura

Takao Nishioka

Kenji Matsunuma

Matsuo Higuchi

Masahiro Yoshida

Akihisa Inoue

Akira Kuibira

Manabu Hashikura

Atsushi Kimura

Hisao Hattori

Kyo Takahashi

Yukinori Yamashita

Shin-ichi Yamagata

Yoshitoshi Hagiwara

Masaaki Honda

Tetsuya Hayashi

Akira Yamakawa

Tetsuya Abe

Yoshio Murakami

Seiji Hiroki

Tsuyoshi Masumoto

Hisashi Kakiuchi

Kazuya Kamitake

Kozo Ito

Ryuji Shiga

Junji Iihara

To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m&#xd7;K or higher and a thermal expansion coefficient of 20&#xd7;10/&#xb0; C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al&#x2014;SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al&#x2014;SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600&#xb0; C. in a non-oxidizing atmosphere.

Susbstrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

A golf club head comprises a face part defining a face for striking a golf ball, and at least a part of the face part made of an alloy satisfying the following three conditions: (1) the alloy is composed of at least three different metallic elements whose group numbers in the periodic system are at least two consecutive numbers; (2) a difference in the atomic radius between at least two of said at least three different metallic elements is not less than 10%; and (3) the heat of mixing of the element that is the major component of the alloy and at least one of the remaining components or the remaining component is not less than &minus;10 kcal/mol.

Golf club head

To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m&times;K or higher and a thermal expansion coefficient of 20&times;10 /&deg; C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al&mdash;SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al&mdash;SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600&deg; C. in a non-oxidizing atmosphere.

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

A tough and heat resisting aluminum alloy comprising aluminum, a transition metal element and a rare earth element, and having a modulated structure which comprises an aluminum matrix and an intermetallic compound precipitated to form a network in the aluminum matrix. Also disclosed in a process for producing the aluminum alloy which comprises the steps of: rapid quenching and solidifying a liquid aluminum alloy at a quenching rate of 10,to 10,K/sec to obtain an aluminum-based supersaturated solid solution; and heat treating the quenched aluminum-based supersaturated solid solution at a heat treating temperature of 473 K or higher, the temperature increasing rate to the heat treating temperature being 1.5 K/sec or higher.

Tough and heat resisting aluminum alloy

To provide a substrate material made of an aluminum/silicon carbide composite alloy which has a thermal conductivity of 100 W/m&times;K or higher and a thermal expansion coefficient of 20&times;10,/&deg; C. or lower and is lightweight and compositionally homogeneous. A substrate material made of an aluminum/silicon carbide composite ally which comprises Al&mdash;SiC alloy composition parts and non alloy composition part and dispersed therein from 10 to 70% by weight silicon carbide particles, and in which the fluctuations of silicon carbide concentration in the Al&mdash;SiC alloy composition parts therein are within 1% by weight. The substrate material is produced by sintering a compact of an aluminum/silicon carbide starting powder at a temperature not lower than 600&deg; C. in a non-oxidizing atmosphere.

An AlN dispersed powder aluminum alloy with a particular composition and structure has excellent wear resistance, seizure resistance, heat resistance, toughness and machinability. In the structure of the alloy, AlN layers are discontinuously dispersed along some of the grain boundaries of former aluminum alloy particles in the matrix of an aluminum alloy sintered body. Diffusion and sintering progresses between non-nitrided grains at areas of grain boundaries not having AlN layers, to attain strong bonding between the grains. A nitriding accelerative element such as Mg, Ca or Li is provided in some of the grains to promote the discontinuous formation of the AlN layers. Additionally, layers of a nitriding suppressive element such as Sn, Pb, Sb, Bi or S may be discontinuously dispersed at regions along some of the grain boundaries, and bonding between grains is achieved at these regions as well. The alloy is prepared by sintering a green powder compact of prescribed composition under prescribed sintering conditions.

ALN dispersed powder aluminum alloy and method of preparing the same

High strength high-toughness aluminum alloy and method of preparing the

A copper series sintered friction material is provided including a foundation constituted by copper alloy powder and containing hard phases and solid lubricant components dispersed uniformly, and exhibits a friction coefficient of 0.3 or more stably without seizure when the sintered friction material frictionally slides against titanium or a titanium alloy in the atmosphere, the foundation containing at least one additive element selected from Zn, Ni, Al, Fe, and Mo.

Sintered friction material

A roller brake or drum brake for a two-wheeler includes a guide case rotating with a wheel, a ring of a sintered copper alloy that is fixedly fitted into the guide case, and a brake shoe of an iron material that is pressed against the inner peripheral surface of the ring thereby exhibiting a braking effect. The sintered copper alloy forming the ring contains hard particles dispersed in the interior of respective grains of copper alloy powder forming the matrix.

Drum brake especially for a two-wheeled vehicle

Slide member of sintered aluminum alloy and method of manufacturing the

A sintered friction material includes a copper alloy base and hard particles. The copper alloy base includes copper and at least one of, and preferably both, Zn and Ni within a total range of 5 to 40 wt % of the copper alloy base. The hard particles are uniformly dispersed in a matrix formed by the original composite copper alloy powder constituting the base, in a content amount j within a range of 10 to 30 wt % of the friction material.

Sintered friction material, composite copper alloy powder used therefor

A sintered friction material having excellent high-temperature strength, heat-resistance, abrasion-resistance and .mu. characteristic, and capable of maintaining high friction coefficient stably is provided. The sintered friction material contains a foundation of titanium and/or titanium alloy powder, a solid lubricant and a fiber of hard material. The sintered friction material having the foundation of titanium and/or titanium alloy powder as the base is lined and joined onto a holder plate to form a friction pad suitable for use with a brake rotor made of titanium or titanium alloy.

Titanium and/or titanium alloy sintered friction material

A material for a semiconductor substrate comprising an aluminum-silicon alloy containing from 50% to 80% by weight of silicon and having a thermal conductivity of 0.28 cal/cm.sec..degree. C. or higher, a coefficient of thermal expansion of 12.times.10.sup.-6 /.degree. C. or smaller and a density of 2.5 g/cm.sup.3 or lower. This material is produced by molding an Al--Si alloy powder, which has been obtained through rapid solidification by atomization, to form a compact and then consolidating the compact by means of forging, sintering, etc. The substrate material may have an Al or Al alloy covering layer at least one surface thereof and, further, as necessary, an insulating or plating layer on the covering layer. The thus obtained substrate material is lightweight and has a suitable coefficient of thermal expansion for a substrate as well as a high thermal conductivity. Therefore, a semiconductor device with high performance and reliability can be obtained using such substrate material.

Semiconductor substate with improved thermal conductivity

Growing community of inventors

Hyogo, Japan

Yoshishige Takano