Hitachi, Ltd.

Hitachi Plant Technologies, Ltd.

Renesas Technology Corp.

Hitachi Industries Co., Ltd.

Enplas Corporation

Washi Kosan Co., Ltd.

Yoshishige Endo

Masatoshi Kanamaru

Ryuji Kohno

Hideyuki Aoki

Atsushi Hosogane

Naoto Ban

Hideo Miura

Takeshi Araya

Hiromitsu Kawamura

Masahiko Ono

Takao Kawamura

Akihiko Ariga

Katsumi Kobara

Yasuhiro Yoshimura

Tatsuya Nagata

Ryuji Kono

Toshio Miyatake

Yukiko Ikeda

Yuzuru Ito

Toshihiro Yamada

Akira Koide

Hiroya Shimizu

Takanori Aono

Susumu Hioki

Yoshiro Ibaraki

Hidekazu Tsudome

Yutaka Ito

Shinji Tanaka

Makoto Kitano

Hiroyuki Ohta

Tetsuo Yokoyama

Takeshi Harada

Hiromitsu Tokisue

Shigenori Togashi

Yuji Yoshitomi

Hiroyuki Ota

Yuji Wada

Teruhisa Akashi

Tetsuro Miyamoto

Masaaki Namba

Nobuyuki Ishii

Sunao Yonekawa

Osamu Narisawa

Youichi Inoue

Yasuyuki Horiguchi

Hiroshi Yuyama

Takanorr Aono

Hiroshi Matsumoto

Kenji Yasuda

Noriyuki Kumasaka

Kenji Tojo

Hajime Kato

Yoshifumi Tomita

Shigeru Machida

Yoshiaki Yamauchi

Katsutoshi Nii

Ryo Miyake

Takao Terayama

Masahiro Takebayashi

Kunihiko Takao

Koichi Sekiguchi

Toshinari Sakurai

Shinichi Fukuzono

Ryoji Okada

Noriyuki Kawahara

Hisahiro Miki

Koichi Inaba

Akihiko Yamamoto

Mitsuaki Haneda

Yukako Asano

Kazuto Oyama

Noriyuki Shige

Kazuo Sekigami

Masahiro Miyazaki

Toshiaki Kawabata

Kenji Sumida

Kazunori Kagei

Masanobu Suzuki

Yoshihiro Moriguchi

Seiji Katayama

Tomoki Hirata

Eiichi Satoh

Akira Matsunawa

Erika Katayama

Yoshihiro Satou

Naofumi Otsuki

Kazuhiro Fujise

Yasuo Ito

Fumiaki Numajiri

Mio Suzuki

Akira Hitachi Ltd Ipg 12Th Floor Koide

In relation to a microreactor, and also a microreactor system applying the same therein, not producing any dead volume therein, and thereby achieving a high level of mixing properties even at a low solution flow rate and having a simple structure thereof, disclosed herein are a microreactor and microreactor system, comprising a channel for mixing up at least two (2) types of fluids, and thereby conducting mixing/reacting of fluids by conducting the mixing/reacting of the fluids at least one (1) time, i.e., being suitable for so-called a multi-step reaction.

Microreactor system

A fluid mixer for mixing a first fluid and a second fluid includes an introducing component having a bore, a cylindrical component fitted into the bore of the introducing component and a mixing component having a conical recess and on which the introducing component and the cylindrical component are held. A first introducing flow path receives the first fluid and a first distributing flow path distributes the first fluid over the whole circumference of the cylindrical component. A second introducing flow path receives the second fluid. A second distributing flow path distributes the second fluid so that the first fluid and the second fluid are alternately arranged in an circumferential direction. A joining part joins together the first fluid and the second fluid fed with the fluids alternately arranged circumferentially.

Fluid mixer

A liquid condensation system heats a liquid raw material under a decompressed circumstance and evaporates a volatile component from a liquid surface to condense the liquid raw material. Therefore, the liquid condensation system includes: liquid condensers, each of which condenses the liquid raw material; a vacuum pump that is in communication with the liquid condensers; and a warm water circulation system as a heating source that heats the liquid raw material in the liquid condensers. The volatile component evaporated in the liquid condensers is led to the outside of the liquid condensers through vapor lines. The condensed liquid that is not evaporated in the liquid condensers is led to the outside of the liquid condensers through condensed-liquid lines. Condensed-liquid-line adjusting valves are interposed on the condensed-liquid lines, and heaters are attached to the condensed-liquid lines. A control unit controls the heaters and the condensed-liquid-line adjusting valves.

Liquid condensation system

A dent is formed on a side surface of a first substrate. A second substrate faces to the side surface of the first substrate. A third substrate is arranged so that the first and second substrates contact each other closely. A micro flow path and a micro chamber are formed between the first and second substrates. The micro flow path and the micro chamber communicate with each other and including an inlet and outlet respectively. A fifth substrate contains the first, second and third substrates. A fourth substrate fits in the fifth substrate. The first and second substrates are pressed against each other by thread fastening (pressing means) for the fourth and fifth substrates.

Micro fluidic device

A joint to be attached to a port of a micro fluidic element, has an outer peripheral surface of truncated subulate shape at a front end portion of the joint to form a front surface as a top of the truncated subulate shape, and a cuneiform space in an inside of the joint at the front end portion of the joint, the joint is made of an elastomer, and the cuneiform space includes a front end overlapping the front surface as seen in a direction along which a tube is guided by the cuneiform space when the tube is inserted into the joint so that the tube is enabled to penetrate the front surface through the front end.

Micro fluidic device and joint therefor

The invention relates to a micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing and reaction (chemical reaction) of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port. A micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing/reaction of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port, the micro fluid chip comprising liquid supplies that supply a plurality of flows, which are formed by division of two kinds of liquids, respectively, in an alternate arrangement, and a flow flattening portion provided downstream of the liquid supplies to be configured in flow passage such that liquids alternately arranged are decreased in dimension as they go downstream and increased in dimension in a direction, which intersects the direction of arrangement and a direction of flow, as they go downstream, to be made substantially the same or slightly large in cross sectional area in the direction of flow. According to the invention, liquids of large flow rates can be processed at high speed and an apparatus is not made large in size.

Micro fluid chip

In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.

Method of manufacturing semiconductor apparatus

A mixed liquid manufacturing apparatus comprises: an information input unit, in which information of an object, to which a mixed liquid is offered, is input; a material storage system that stores a plurality of materials for a mixed liquid; a product information system that selects kinds and quantities of the stored materials on the basis of the input information of the object, to which a mixed liquid is offered; a liquid transfer unit, by which the selected materials are taken out from the material storage system; a mixing unit, in which the materials supplied from the liquid transfer unit are mixed; an injection unit, by which the mixed liquid is injected into a mixed liquid container; an input unit, by which matters being declared on a label of the mixed liquid container are input; and a label formation unit, in which the input matters are printed on the label and the label is stuck on the mixed liquid container, and wherein the label formation unit begins printing before the injection unit completes injection of the mixed liquid into the container.

Mixed liquid manufacturing apparatus

A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

Packaging device for holding a plurality of semiconductor devices to be inspected

A semiconductor device testing apparatus is realized, which allows contactors to be positioned throughout the wafer surface highly accurately for uniform contact, testing a large-sized wafer, and cost reduction. A plurality of divided contactor blocks is formed with a positioning groove. The groove is used to position the plurality of contactor blocks with a positioning frame. Because the contactor blocks are divided into plurals, it is less likely that a partial surface distortion affects other portions to impair surface flatness as compared with the case where a plurality of non-divided contactors is formed integrally, and the plurality of contactor blocks can be brought into contact with a wafer to be tested uniformly. Additionally, even though abnormality is generated in a part of the contactor blocks, only the part of the contactor blocks is replaced. Therefore, replacement costs can be reduced as compared with the case where a plurality of non-divided contactors is formed integrally.

Semiconductor device testing apparatus and method for manufacturing the same

A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.

Semiconductor-device inspecting apparatus and a method for manufacturing the same

A semiconductor inspection apparatus which is possible to inspect a plurality of semiconductor devices collectively at one time, which has conventionally been difficult because of precision or the like of probes. A method of manufacturing the semiconductor inspection apparatus comprises the steps of forming a cover film on a surface of the silicon substrate and forming a plurality of probes of a polygonal cone shape or a circular cone shape through etching after patterning by photolithography, after the cover film is removed, again forming a cover film on the surface of the silicon substrate and forming a beam or a diaphragm for each probe through etching after patterning by photolithography, after the cover film is removed, again forming a cover film on the surface of the silicon substrate and forming a through hole corresponding to the probe through etching after patterning by photolithography, and after the cover film is removed, forming an insulating film on the surface of the silicon substrate, forming a metal film on a surface of the insulating film, and forming a wiring lead through etching after patterning by photolithography.

Semiconductor inspection apparatus

A method of manufacturing a semiconductor device includes forming process of forming a semiconductor element on a semiconductor wafer and testing process of testing electrical performance of the formed semiconductor element. The testing process includes process of electrically connecting a testing apparatus to an electrode pad formed on the semiconductor element to be tested. The testing apparatus has a probe-formed substrate including a plurality of beams having probes to be electrically connected to the electrode pads. The probe-formed substrate has a first beam having at least one probe for electrically connection with the electrode pad and a second beam having a number of probes for electrical connection with the electrode pads of which number is more than the number of the electrode pads electrically connected by said first beam.

Semiconductor device and a manufacturing method thereof

Semiconductor device chips manufacturing and inspecting method is disclosed in which a semiconductor wafer is cut into individual LSI chips. The LSI chips are rearranged and integrated into a predetermined number. The cut LSI chips are integrated in a jig having openings with a size commensurate with the dimensions of the LSI chip. At least one part of the jig having such openings has a coefficient of thermal expansion that is approximately equal to that of the LSI chips. The integrated predetermined number of chips are subjected to an inspection process in a subsequent inspection step thereby improving efficiency and reducing cost.

Semiconductor device manufacturing method

Manufacture method for semiconductor inspection apparatus

Growing community of inventors

Tsuchiura, Japan

Yoshishige Endo