Tdk Corporation

Yoshiro Nakagawa

Satoshi Inoue

Osamu Fukuroi

Toyoaki Tanaka

Kiyosumi Kanazawa

A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.

Electroplating apparatus

The present invention is directed to an MR element and a thin film magnetic head that do not cause an increase in the electrical resistance value due to the presence of dead zones. When forming passive areas that include magnetic domain control films and conductive films at the two sides of a central active area through a vacuum film formation method, the magnetic domain control films are formed under film forming conditions that are different from the film forming conditions under which the conductive films are formed to ensure that the degree to which the conductive films overlap the central active area is set larger than the degree to which the magnetic domain control films overlap the central active area.

Method for manufacturing a magnetoresistive element with conductive films and magnetic domain films overlapping a central active area

A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 &mgr;m or more.

Method of manufacturing lapping control sensor for magnetoresistive effect head

Electroplating method

A lapping control sensor for a MR head includes a multi-layered structure of a metallic layer, an insulation layer, a resister layer and a lead conductor layer, and being provided in parallel with the MR head which has a multi-layered structure of at least a lower shield layer, a shield gap insulation layer, a MR layer and a lead conductor layer is provided. The insulation layer of the lapping control sensor has a thickness larger than that of the shield gap insulation layer of the MR head. The thickness of the insulation layer of the sensor is 0.1 .mu.m or more.

Growing community of inventors

Yamanashi, Japan

Yoshiro Nakagawa