Seiko Epson Corporation

Yoshiro Iwasa

Hiroyasu Honda

Yukinari Shibata

Mihiro Nonoyama

Hideki Ogawa

Keitaro Fujimori

Yoshiteru Ono

An integrated circuit device includes: a first pad to an ith pad connected to a first memory pad to an ith memory pad of a memory stacked in the integrated circuit device; a jth pad to a kth pad connected to a jth memory pad to a kth (1&#x3c;i&#x3c;j&#x3c;k) memory pad of the memory; and at least one pad arranged between the ith pad and the jth pad, wherein the at least one pad is not connected to a memory pad of the memory and serves as a pad for input or output a signal between an external device and the integrated circuit device.

Integrated circuit device and electronic equipment

A flexible substrate including: a first part provided with a first device DV; a second part provided with a second device; a wiring part placed between the first part and the second part and including a plurality of wirings for coupling the first device and the second device; the first device including at least a first data transfer control unit, the second device including at least a second data transfer control unit, the first data transfer control unit and the second data transfer control unit transferring data by using a differential signal, and the plurality of wirings for coupling the first device and the second device including at least one differential signal line pair for transferring data by using a differential signal.

Flexible substrate and electronic equipment

A semiconductor device and an input/output (I/O) cell placement method can cope with reduction of the chip area and increase in the number of pins, without changing a core transistor region inside the semiconductor device. A semiconductor chip of the semiconductor device has a core transistor region, an I/O cell placement region and a pad placement region. At least two columns of I/O cells to be placed in the I/O cell placement region of the semiconductor chip are arranged in a direction perpendicular to the arranging direction of pads arranged along the outer peripheral portion of the semiconductor chip and in such a manner that the longitudinal direction (height directions) of the chip is parallel to the pad arranging direction.

Input/output cell placement method and semiconductor device

A semiconductor device that is capable of correctly transferring signals at high speed. The semiconductor device includes a semiconductor chip, a light-receiving element formed in the semiconductor chip for receiving an optical signal, and a glass fiber as an optical signal transfer device connected to the light-receiving element for transferring the optical signal into the semiconductor chip. Optical signals have a smaller attenuation of signal amplitude and have a higher transfer speed compared to electrical signals. Therefore, by transferring signals in the form of optical signals, the semiconductor device that can correctly transfer signals at high speed is obtained.

Growing community of inventors

Matsumoto, Japan

Yoshiro Iwasa