Mitsubishi Gas Chemical Company, Inc.

Yoshio Yoshikawa

Yoshiaki Inoue

Akira Amemiya

Toshio Komatsu

Takanari Nawata

Isamu Yoshino

Megumu Yuyama

Takeshi Nagasaka

Teruo Takeuchi

Shigeru Murabayashi

Yoshihiko Harima

Mikio Goto

Yuichi Fujii

Kazuo Fujinami

Hidenori Kimpara

Sadao Otsuka

Yukio Kondo

Sigeru Kimoto

Disclosed are an inhibitor parcel comprising (a) a composition comprising an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point unwoven fabric onto the other side of the base sheet, said permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2.Atm.Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 H.sub.2 O mg.Atm/O.sub.2 ml! or above at 25.degree. C. at a relative humidity of 50% and said composition (a) being parcelled by said permeable diffusing-parcelling material (b) and an inhibitor parcel for use in electronic devices and electronic parts which comprises said inhibitor parcel and a method for preserving electronic devices and electronic parts using said inhibitor parcel.

Inhibitor parcel and method for preserving electronic devices or

A flux-free method for bonding a member which is at least partially metallic to another member is provided including preserving the at least partially metallic member in a container having a low gas permeability, together with a packet containing a rust-proof composition; and bonding the at least partially metallic member with the other member by using a filler material.

Method for bonding a member having metal

Disclosed are an inhibitor parcel including (a) a composition including an unsaturated fatty acid compound as its main ingredient and (b) a permeable diffusing-parcelling material prepared by laminating and bonding an oxygen-permeable resin layer onto one side of a base sheet made of a fibrous material and an adhesive or onto one adhesive-coating side of a base sheet made of a fibrous material, then laminating and bonding thereonto an oxygen-permeable resin layer and laminating and bonding a porous film of low softening point resin or a low softening point nonwoven fabric onto the other side of the base sheet, the permeable diffusing-parcelling material (b) having an oxygen permeability of 10.sup.4 to 10.sup.6 ml/m.sup.2. Atm. Day and a (water vapor permeability/oxygen permeability) ratio of 0.02 [H.sub.2 O mg.Atm/O.sub.2 ml] or above at 25.degree. C. at a relative humidity of 50% and the composition (a) being parcelled by the permeable diffusing-parcelling material (b) and an inhibitor parcel for use in electronic devices and electronic parts which includes the inhibitor parcel and a method for preserving electronic devices and electronic parts using the inhibitor parcel.

The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

Method of bonding a metal by solder

An oxygen indicator adapted for printing or coating which comprises (a) at least one reducing agent, (b) a dyestuff causing color change when it is reduced with the reducing agent, (c) at least one thickening agent and (d) at least one solvent and a sheet-like oxygen indicator in which a composition comprising the above four components (a)-(d) is coated or printed on a substrate are disclosed.

Oxygen indicator adapted for printing or coating and oxygen-indicating

An oxygen absorbent comprising (a) metal halide-coated metal powder having at least one metal halide coated on the surface of at least one metal powder, the amount of metal halide coated being in the range of from about 0.001 part to about 10 parts by weight per 100 parts by weight of the metal powder, and the water content of the metal halide-coated metal powder being less than 1% by weight on the basis of total weight of the metal halide-coated metal powder an (b) a water-containing material and a process for producing the same are disclosed.

Oxygen absorbent

An oxygen indicator comprising at least one dyestuff, at least one alkaline substance and at least one reducing agent is disclosed.

Oxygen indicator

An oxygen absorbent comprising a metal powder and a metal halide coated thereon is disclosed.

An oxygen absorbent comprising at least one alkaline earth metal sulfite, at least one ferrous compound and free water is disclosed.

An oxygen absorbent comprising a dithionite and at least one compound having water of crystallization or water of hydration is disclosed.

A process for treating a waste liquor from a hydrosulfite process by an activated sludge process is improved by aerating the waste in the presence of a metal ion before the activated sludge process.

Growing community of inventors

Tokyo, Japan

Yoshio Yoshikawa