Nhk Spring Co., Ltd.

Technican Company Ltd.

Thomas & Betts Corporation

Daido Kogyo Co., Ltd.

Yoshio Yamada

Hiroshi Nakayama

Mitsuhiro Nagaya

Tsuyoshi Inuma

Takashi Akao

Shuji Takahashi

Takao Kobayashi

Hideaki Seki

Kazuhito Hiraoka

Toshio Kazama

Shunsuke Sasaki

Norihiro Tajima

Kohei Hironaka

Shigeki Ishikawa

Kazushi Watanabe

Hironobu Imaizumi

Osamu Ito

Shogo Imuta

Satoshi Shoji

Mitsuhiro Kondo

Masami Kudo

Makoto Yumino

Katumi Yamakawa

The spring member () includes a conductive plate () and a support plate (), the conductive plate is formed of a material in which at least one of electrical conductivity and thermal conductivity thereof is higher than that of a material forming the support plate, the support plate is formed of the material having a higher Young's modulus than that of the material forming the conductive plate, two end portions of the conductive plate in a second direction (X) are provided with first contact portions () that contact a first pressed body (W), an intermediate portion of the conductive plate in the second direction is provided with a second contact portion () that contacts a second pressed body (W), the two end portions of the conductive plate in the second direction are engaged with two end portions of the support plate in the second direction, an intermediate portion of the support plate in the second direction is provided with a third contact portion () that contacts the second contact portion, and the second contact portion is sandwiched between the third contact portion and the second pressed body in a first direction (Z).

Spring member

A tensioner includes a movable section, a fixed section, a flat spiral spring, and a back-up spring. The movable section receives load from an entrained transmission body through a tension member. The fixed section supports the movable section so as to be capable of displacing. The flat spiral spring biases the movable section so as to resist the tension member. The flat spiral spring unwinds in a state in which there is a small inter-plate friction force in cases in which there is a large biasing force applied to the tension member to counter load acting from the tension member. The flat spiral spring winds-up in a state in which there is a large inter-plate friction force in cases in which there is a small biasing force applied to the tension member to counter load acting from the tension member. The back-up spring limits wind-up of the flat spiral spring.

Tensioner

A tensioner includes a power spring, and a backup member being in contact with the power spring and supporting the power spring by acting an urging force in a direction opposite to a radial shift of the power spring in a direction in which the power spring is wound. The power spring is unwound in a condition in which an inter-plate frictional force of the power spring is small in a case where an urging force acting from a power spring to a tension member is greater than a load acting from the tensioner arm to the power spring and the power spring is wound in a condition in which the inter-plate frictional force of the power spring is large in a case where the urging force acting from the power spring to the tension member is smaller than the load acting from the tension member to the power spring.

A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe () are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block () that comes into contact with both end portions of the large current probe ().

Probe unit

The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit.

An apparatus and a method for freezing foods includes a first conveyor having one end thereof located on the feed portion and that conveys the articles to be frozen in a first direction and a second conveyor extending directly beneath the first conveyor along thereof and conveying foods fallen from the other end of the first conveyor in a second direction opposite to the first direction. The apparatus further includes a coolant tank disposed beneath the second conveyor and storing coolant that freezes foods fallen from the second conveyor, a third conveyor having at least one portion thereof submerged in the coolant in the coolant tank and conveying the foods fallen from the second conveyor while immersing them in the coolant, and a coolant spraying means disposed above the first conveyor and spraying coolant toward the first conveyor.

Continuous food freezing device and continuous food freezing method

A contact structure unit that achieves electrical continuity between a substrate, which includes a plurality of electrodes, and a contact object includes a first-type contact-carrying member including a contact portion which makes contact with the contact object; includes a plurality of second-type contact-carrying members each of which includes a leading end portion formed at one end portion and making contact with the electrodes and each of which makes contact with the first-type contact-carrying member at the other end portion; and includes a plurality of coil springs each of which is disposed between the contact portion and the leading end portions and each of which biases the contact portion and the leading end portions.

Contact structure unit

The invention provides a method and an apparatus for producing frozen products using a liquid cooling freezing method, enabling the number of times for replenishing a freezing solvent to be reduced and completely preventing alcoholic odor from occurring. The apparatusfor producing frozen products according to the invention includes, in a freezing chamber, a freezing tankhaving a freezing solventstored therein for immersing therein products and freezing them, gas jetting unitsfor jetting a gas having a temperature of 0&#xb0; C. or below against the products frozen in the freezing tankto remove the freezing solvent adhering to the products, and a transferring devicefor transferring the products to be frozen in the freezing chamberin a manner that the products to be frozen are immersed in the freezing solventin the freezing tankand then lifted from the freezing tankand further the freezing solvent adhering to the products is removed by the gas jetting units

Method and apparatus for producing frozen products

A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring () that presses a portion near an edge portion of a surface of a probe head () from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head () is positioned inside of an outer edge of the probe head (), and a point (P) of application of force applied from the retainer () that presses a portion near an edge portion of a space transformer () over an entire circumference in the direction of the substrate to the space transformer () is positioned inside of an outer edge of the space transformer ().

Probe card for a semiconductor wafer

A probe card includes probes that come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate and includes a housing having connection terminals resilient in an axial direction thereof and hole portions each housing one of the connection terminals; and a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires.

Probe card

A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.

Probe card electrically connectable with a semiconductor wafer

A parallelism adjusting mechanism of a probe card is provided. The parallelism adjusting mechanism can bring probes held by a probe card into uniform contact with a wafer even if a parallelism between a mounting reference surface for the probe card and the wafer as a test object is lost. To achieve this purpose, specifically, to adjust a parallelism of a probe card () that holds a plurality of probes () for electrically connecting a wafer () as a test object and a circuitry for generating a signal for a test with respect to the wafer (), adjusting screws () as at least part of an inclination changing unit are provided. The inclination changing unit changes a degree of inclination of the probe card () with respect to a mounting reference surface (S) of a prober () for mounting the probe card () thereon.

Parallelism adjusting mechanism of probe card

A probe card includes probes that are made of a conductive material and come into contact with a semiconductor wafer to receive or output an electric signal; a probe head that holds the probes; a substrate that has a wiring pattern corresponding to a circuit structure for generating a signal for a test; a reinforcing member that reinforces the substrate; an interposer that is stacked on the substrate for connection of wires of the substrate; a space transformer that is stacked between the interposer and the probe head and transforms intervals among the wires; and a plurality of first post members that have a height greater than the thickness of the substrate, and are embedded in a portion of the substrate on which the interposer is stacked.

A probe card includes a flat wiring board having a wiring pattern corresponding to a circuit structure for generating a signal for a test, an interposer that is stacked on the wiring board and relays wirings of the wiring board, a space transformer that is stacked on the interposer and fastened thereto by an adhesive, transforms a space between the wirings relayed by the interposer, and leads the wirings out to a surface opposite a surface facing the interposer, and a probe head that is stacked on the space transformer and houses and holds a plurality of probes.

Provided is a probe card capable of surely bringing probes into contact with a contact object regardless of a temperature environment of a test. To achieve the object, the probe card includes a plurality of probes that are made of a conductive material and come into contact with electrode pads of a semiconductor wafer to input or output an electric signal; a probe head that houses and holds the probes; a substrate that has a wiring pattern corresponding to the circuitry; and a space transformer that is stacked on the probe head, changes a space of the wiring pattern of the substrate and thus relays wires, and has electrode pads provided on a surface on a side opposed to the probe head in association with the relayed wires. Both ends of the probes come into contact with portions near the centers of the electrodes pads of the semiconductor wafer and the space transformer under an environment having an average temperature of a lowest temperature and a highest temperature in testing the semiconductor wafer.

Growing community of inventors

Nagano, Japan

Yoshio Yamada