Sumitomo Metal (Smi) Electronics Devices, Inc.

Yoshio Tsukiyama

Masato Shiobara

Yoshihisa Araya

A connected construction of a high-frequency package and a wiring board have an excellent high-frequency transmission characteristic without degradation of the transmission characteristic of even high-frequency signals in a wide band ranging from 20 GHz to 80 GHz in the case of connecting a high-frequency package to a wiring board. A distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of a high-frequency transmission line substrate constituting the high-frequency package, and a distance between conductive vias and conductive vias to connect grounds formed on both main surfaces of the wiring board on which the high-frequency package is mounted, are set in consideration of the dielectric constant of the high-frequency transmission line substrate and the dielectric constant of the wiring board in order to improve the high-frequency transmission characteristic between the high-frequency transmission line substrate and the wiring board.

Connected construction of a high-frequency package and a wiring board

A highfrequency package has an excellent high-frequency characteristic in a band from quasi-millimeter wavelength to 90 GHz frequency. A sealed construction can be easily manufactured, leading to a reduction in cost, and is excellent in strength. A ring-shaped frame and signal lines facing each other with the ring-shaped frame between in the inside and outside regions separated by the ring-shaped frame are formed on one main surface side of a dielectric substrate, and grounds are formed around the signal lines with gaps interposed between in the same plane, while signal lines and a ground around the signal lines with gaps interposed between in the same plane are formed on the other main surface side of the dielectric substrate, wherein conductive vias for vertically connecting each of one end portions of the signal lines and both end portions of the signal line are formed, and a plurality of conductive vias for vertically connecting the grounds and the ground are formed at prescribed intervals on both sides with the signal lines between.

Growing community of inventors

Toyonaka, Japan

Yoshio Tsukiyama