Nitto-denko Corporation

Yoshio Terada

Makoto Namikawa

Eiji Toyoda

Kenji Furuta

Daisuke Uenda

Yasuhiro Amano

Jirou Nukaga

Hirofumi Fujii

Fumiteru Asai

Yukio Arimitsu

Akihisa Murata

Shoujirou Moriki

Tadashi Takahashi

Junichi Nakayama

Midori Tojo

Mitsuhiro Kanada

Kazumasa Igarashi

Yuki Sugo

Akira Hirao

Hitoshi Ishizaka

Takashi Wano

Youhei Maeno

Yoshinori Yoshida

Akira Shouji

Kouki Tomioka

Kazunori Hayashi

Hirokuni Hashimoto

Ryo Morioka

Nobuaki Maruoka

Shu Sasaki

Kota Nakao

Jyunichi Nakayama

Rie Yuto

Asami Funatsu

Daisuke c/o Nitto Denko Corporation Uenda

A thermally-conductive pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing thermally-conductive particles. One side of the sheet is an adhesive face, and the other side is a non-adhesive face. The thermally-conductive pressure-sensitive adhesive sheet may include a non-adhesive layer on or over only one side of the pressure-sensitive adhesive layer. In this case, the ratio of the thickness of the non-adhesive layer to the thickness of the pressure-sensitive adhesive layer is preferably 0.04 to 0.6. The thermally-conductive pressure sensitive adhesive sheet preferably has a thermal resistance of 6 K&#xb7;cm/W or less. The thermally-conductive pressure sensitive adhesive sheet preferably has a total thickness of 50 to 500 &#x3bc;m.

Thermally-conductive pressure-sensitive adhesive sheet

A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a substrate layer configured to support the pressure-sensitive adhesive agent layer. The pressure-sensitive adhesive layer has a storage modulus of 250 kPa or less at 23&#xb0; C. The substrate layer has an elastic modulus of 1680 N/cm to 3000 N/cm both inclusive. The pressure-sensitive adhesive sheet shows a deviation amount less than 1.0 mm. The amount is the deviation amount of the pressure-sensitive adhesive sheet per 250 gf/cmof the sheet in a holding ability test at 80&#xb0; C. after one hour from a time when the test is started.

Pressure-sensitive adhesive sheet

An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 &#x3bc;m or more to about 50 &#x3bc;m or less and at least one further peak top existing in a particle size range from about 1 &#x3bc;m or more to about 12 &#x3bc;m or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm.

Electro-conductive pressure-sensitive adhesive tape, an electronic member, and a pressure-sensitive adhesive

A pressure-sensitive adhesive sheet includes a pressure-sensitive adhesive layer and a base including a metal layer and a resin layer, and a product of an initial elastic modulus of the base and a total thickness of the base is 3000 N/mm or less, and a separation distance is 2 mm or less, the separation distance is measured with a peel test with a constant load as follows: a test piece of the pressure-sensitive adhesive sheet having a 10 mm width and a 100 mm length is attached to a surface of a stainless steel test plate and then, the test plate is left standing at a temperature of 23&#xb0; C. for twenty four hours and then, a load of 100 gf is applied to one end of a length dimension of the test piece vertical to the surface of the test plate and a separation distance of the test piece is measured after one hour.

Pressure-sensitive adhesive sheet and magnetic disk drive

A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180&#xb0; peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer.

Label sheet for cleaning and conveying member having cleaning function

An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.

Thermally conductive member, and battery device using the same

Thermally conductive member and battery pack device using same

The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25&#xb0; C., of 1 GPa or lower and a modulus of elasticity at 250&#xb0; C. of 1 MPa or higher, or a precursor resin thereof.

Heat-resistant resin

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mmis 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

A cleaning sheet which comprises a porous layer as a cleaning layer; or a cleaning sheet which comprises a sheet material having a porous layer and, formed on one side of the sheet material, an adhesive layer.

Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these

Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Pressure-sensitive adhesive sheet for testing

A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

Pressure-sensitive adhesive sheet and process for producing semiconductor device having same

A cleaning sheet comprises a cleaning layer provided on one side of a base material, from which cleaning layer F, Cl, Br, NO, NO, PO, SO, Na, NHand Kare extractable with pure water each in an amount of not greater than 20 ppm, when extracted under boiling at 120&#xb0; C. for 1 hour, and a pressure-sensitive adhesive layer provided on the other side of the base material, a carrying material with cleaning capacity comprising the aforementioned cleaning sheet laminated on a carrying material with a pressure-sensitive adhesive layer. The present disclosure also relates to a method for cleaning a substrate processing equipment which comprises conveying the aforementioned carrying material with cleaning capacity into the substrate processing equipment.

Cleaning sheet and method of cleaning substrate processing equipment

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Growing community of inventors

Ibaraki, Japan

Yoshio Terada