Seikosha Co., Ltd.

Mitsubishi Electric Corporation

Nitto Chemical Co., Ltd.

Yoshio Tamura

Yoshiaki Ikeda

Shinichi Suzuki

Tadashi Kimura

Koji Yamazaki

Maurizio Corti

Marco Volpato

Masahiko Nanri

Masashi Suematsu

Makoto Ide

Hiroshi Noritake

Hiromi Hasegawa

Takuhiko Ohashi

Kozo Hatsumi

Takehiro Miyazawa

Osamu Hatsumi

Yasuki Onizuka

Isao Naganuma

Tetsuya Matayoshi

Kouei Miyazato

Kazuhiro Takaishi

Nobuo Okamura

Provided is a joint structure interposed between a semiconductor element and a substrate, the joint structure including: a Sn phase; Cu alloy particles containing P in an amount of 1 mass % or more and less than 7 mass %; and Ag particles, wherein the Cu alloy particles are each coated with a CuSnlayer, wherein the Ag particles are each coated with a AgSn layer, wherein the Cu alloy particles and the Ag particles are at least partially bonded to each other through a CuSnphase, wherein a total of addition amounts of the Cu alloy particles and the Ag particles is 25 mass % or more and less than 65 mass % with respect to the joint structure, and wherein a mass ratio of the addition amount of the Ag particles to the addition amount of the Cu alloy particles is 0.2 or more and less than 1.2.

Joint structure, semiconductor device, and method of manufacturing same

In a configuration of a method for preventing progression of corrosion in a steel pipe structure according to the present invention, two or more types of liquidsare injected, while being mixed, into a steel pipe that constitutes the steel pipe structure, from an opening at one of both ends of the steel pipe, and the inside of the steel pipe is filled with resin foam product (foam product) by foam expansion and hardening of the two or more types of liquids.

Preventing progression of corrosion in steel pipe structure

A lead screw for moving, for example, a printing head or a magnetic head. The screw is molded from plastics by a split mold comprising a plurality of longitudinally extending sections. It has on its outer peripheral surface a helical groove satisfying the following relationship: ##EQU1## where P: pitch of the groove;

Lead screw for moving a head

Disclosed is a travelling control of printing head in which when a printing head is to be returned to its home position, the printing head is returned in a selected one of two modes, the first mode being such that a lead screw is reversely rotated upon completion of a desired printing operation to cause the printing head to return to its home position through a first guide groove provided for the forward travelling of the printing head and the second mode being such that the lead screw is rotated forward even after the completion of the desired printing operation and the guide groove is changed from the first one to a second one which is provided only for the return travelling of the printing head and which has a pitch larger than that of the first one so that the printing head can be quickly returned to its home position at a speed higher than that in the forward travelling. Thus, the return mode can be selected such that the time required for the printing head to return to its home position in the selected mode is shorter than in the other mode.

Device for controlling the carriage return of a lead screw driven

Growing community of inventors

Tokyo, Japan

Yoshio Tamura