Mitsubishi Denki Kabushiki Kaisha

Yoshio Saito

Akihiro Suzuki

Kenyu Haruta

Koichi A Ono

Tomohiro Sasagawa

Hitoshi Wakata

Tetsuya Takami

Kazuyoshi Kojima

Yukihiko Wada

Yukio Sato

Akihiko Furukawa

Tsuyoshi Horikawa

Mitsuo Inoue

Takaaki Kawahara

Toshiyuki Oishi

Taisuke Furukawa

Shuichi Fujikawa

Naohiko Fujino

Noboru Mikami

Kenichi Kuroda

Mutsumi Tsuda

Hideki Yabe

Junji Tanimura

Kazuo Kuramoto

Kouji Kise

Keisuke Nanba

Akimasa Yuki

Tetsuo Makita

Hiroshi Kuroki

Tetsuo Ogama

Yasuji Matsui

Hitoshi Wakata, Deceased

A thin film forming apparatus using laser includes a chamber (1), a target (5) placed therein, a laser light source (10) for emitting laser beam to target (5), and a substrate holder (3). When target (5) is irradiated with laser beam (16), a plume (15) is generated, and materials included in plume (15) are deposited on the surface of a substrate (2) held by substrate holder (3). The laser beam emitted from laser light source (10) has its cross section shaped to a desired shape when passed through a shielding plate (4804), for example, so that the surface of the target (5) is irradiated with the beam having uniform light intensity distribution. Therefore, a plume (15) having uniform density distribution of active particles is generated, and therefore a thin film of high quality can be formed over a wide area with uniform film quality, without damaging the substrate.

Thin film forming apparatus using laser

The laser transfer machining apparatus comprises a shaping unit for shaping the laser beam so that the laser beam has a beam pattern which corresponds to a desired pattern to be machined in the object to be machined and a generating unit disposed separately from the shaping unit for simultaneously generating a plurality of laser beams each having the beam pattern from the laser beam shaped by the shaping unit. The generating unit is adapted to emit the plural laser beams while simultaneously defining a plurality of radiation directions of the generated plural laser beams to the object to be machined. The laser transfer machining apparatus can provide a high efficiency of utilization of light and reduce the time required for machining. Furthermore, the laser transfer machining apparatus can utilize a laser with a relatively low spatially coherence such as an eximer laser.

Laser transfer machining apparatus

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Hyogo, Japan

Yoshio Saito