Tdk Corporation

The Westaim Corporation

Yoshio Saita

Masato Susukida

Jun Hagiwara

Katsuto Nagano

Jun Hirabayashi

Atsushi Yoshida

Yukihiko Shirakawa

A composite substrate includes a substrate, an electrode formed on the substrate, a first dielectric layer of thick film dielectric formed on the electrode, a second dielectric layer formed on the first dielectric layer by a solution coating-and-firing technique, and a buffer layer formed below and/or within the first dielectric layer. The composite substrate keeps the thick-film dielectric layer fully insulating and enables functional thin films formed thereon such as a light emitting layer to perform stable operation, especially stable light emission. An EL panel using the same and a method for preparing the same are also provided.

Composite substrate, EL panel using the same, and making method

A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a flat or protruded printing surface which is brought into contact with a heat sensitive record medium, a heat generating section including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer, and a reinforcing member made of a low melting pint glass and provided on a side of the heat generating section remote from the protection layer. The reinforcing member improves a mechanical strength of the thermal head. The reinforcing member made of a glass also serves as a heat storage member, and thus a thermal property of the thermal head is improved. The reinforcing member may be formed by an aggregate of ceramic particles. The reinforcing member may contain a heat storage layer made of a low melting point glass and a heat conduction layer provided on the heat storage layer.

Thermal head and method of manufacturing the same

An wear-resistant layer constituting a printing surface which is brought into contact with a thermal record medium is formed on a provisional substrate having a groove formed in its surface, said groove having a substantially semicircular cross section, and a heat generating layer electrically conductive layers and electrically connected to the heat generating layer, a protection layer and a heat storage layer are stacked in turn to form a printing section. Next, a driving IC for controlling a heating electric power to be supplied to the printing section is connected to the electrically conductive layer and a wiring section for connecting the driving IC to an external circuit is provided. Thereafter, the printing section is secured to a heat dissipating member by means of a resin and a common electrode and wires are secured to the heat dissipating member by means of both-sided adhesive tapes and After covering an assembly with an etching resist except for the substrate the substrate is removed by etching and the printing surface protruded outwardly is exposed.

A thermal head including a protection layer having mutually opposed first and second surfaces, said first surface having a printing surface which is brought into contact with a heat sensitive record medium and is protruded from the remaining portion of the first surface of the protection layer, a heat generating sections including resistors and electrodes connected to the electrodes and provided on said second surface of the protection layer at said protruded printing surface, a heat control section including a heat storage layer and a heat conduction layer and provided on said heat generating section, and a driving IC connected to said electrodes. In order to improve the mechanical strength of the thermal head, a reinforcing layer made of a glass is provided on said first surface of the protection layer except for said printing surface such that a surface of said reinforcing layer is not higher than said first surface of the protection layer at said protruded printing surface.

Growing community of inventors

Yamanashi Pref., Japan

Yoshio Saita