Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Sumitomo Wiring Systems, Limited

Autonetworks Technologies, Limited

Sumitomo Electric Fine Polymer, Inc.

Yoshio Oka

Takashi Kasuga

Hiroshi Ueda

Jinjoo Park

Kousuke Miura

Yoshifumi Uchita

Koji Nitta

Issei Okada

Yoshiro Adachi

Shoichiro Sakai

Motohiko Sugiura

Kayo Hashizume

Shigeaki Uemura

Noriki Hayashi

Yasushi Mochida

Junichi Okaue

Kenji Ohki

Sumito Uehara

Tadahiro Kaibuki

Yasuhiro Okuda

Shigeyoshi Nakayama

Narito Yagi

Kazuhiro Miyata

Hitoshi Takii

Hiroki Hirai

Takafumi Uemiya

Makoto Nakabayashi

Hideki Matsuoka

Kenji Miyazaki

Kazuyuki Maeda

Hideki Kashihara

Atsushi Kimura

Masahiko Kanda

Masamichi Yamamoto

Takanobu Shimada

Masanao Yamashita

Eiko Imazaki

Satoshi Kiya

Akira Harada

Junichi Motomura

Kyouichirou Nakatsugi

Takeshi Sakamoto

Yuichiro Yamanaka

Manabu Sudou

Tetsuya Shimomura

Ippei Tanaka

Takayuki Yonezawa

Jyunichi Ono

Junichiro Nishikawa

Kouki Nakama

Yugo Kubo

A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Flexible printed circuit board and method of manufacturing flexible printed circuit board

A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Flexible printed circuit board and method of manufacturing same

A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.

Flexible printed circuit board

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 &#x3bc;m.

Method of making printed circuit board and laminated structure

According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.

Method of manufacturing flexible printed interconnect board

A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.

According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr&#x3c;0.1 mg/m, and Ni&#x3c;0.1 mg/m, wherein an arithmetic mean roughness (Sa) of the surface of the base film on which the metal layer is layered is less than 0.10 &#x3bc;m.

Base material for printed circuit board and printed circuit board

A terminalincludes a terminal connection portionconnected to a counterpart terminal and a board connection portionconnected to a conductive pathof a board. The board connection portionhas a plate shape portionthat is a plate shape. The plate shape portion is disposed behind the terminal connection portionand is soldered to the conductive pathof the board. The board connection portion has a plate-shape first projection wallsA toD that are bent from edge portions of a lateral direction side of the plate shape portionand that project to an opposite side to the boardside. The plate shape portionand the first projection wallsA toD have a plating layerthat is formed on a plate surface of the plate shape portion and the first projection walls.

Board with terminal

A resin film according to one aspect of the present invention is a resin film having polyimide as a main component, the resin film including a modified layer formed in a depth direction from at least one side of the resin film; and a non-modified layer other than the modified layer, wherein a ring-opening rate of an imide ring of the polyimide in the modified layer is higher than a ring-opening rate of an imide ring of the polyimide in the non-modified layer, and an average thickness of the modified layer from the one side of the resin film is greater than or equal to 10 nm and less than or equal to 500 nm.

Resin film, substrate for printed wiring board, and printed wiring board

A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 &#x3bc;m and less than or equal to 0.5 &#x3bc;m.

A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer

A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated at least at a position opposite the terminal connecting area, wherein a shape of an end edge of the reinforcement member on the same side as an opposite end edge of the conductive pattern includes a periodic form constituted by curved lines.

Growing community of inventors

Osaka, Japan

Yoshio Oka