Kyocera Corporation

Yoshio Ohashi

Kunihide Shikata

Kiyotaka Nakamura

Keiichi Sekiguchi

Yuuichi Abe

Takeyuki Arai

Shodai Takayoshi

Eisuke Hirano

A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 &#x3bc;m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.

Resistor, circuit board, and electronic device

A light emitting element-mounting substrate of the present disclosure includes a base body, a metal layer and a glass layer. The base body is formed of ceramics. The metal layer is disposed on the base body, and contains copper as a main component. The glass layer is disposed on the metal layer, has a white color tone and contains a compound including titanium and oxygen.

Light emitting element-mounting substrate and light emitting apparatus

The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.

Circuit board and electronic apparatus including the same

A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion.

Circuit board and electronic device including same

A circuit board is provided with a metal wiring layeron at least one principal surface of a ceramic sintered body, wherein the above-described metal wiring layer includes a first regionwhich is in contact with the principal surface and which contains a glass component and a second regionwhich is located on the first regionand which does not contain a glass component, the thickness of the first regionis 35% or more and 70% or less of the thickness of the metal wiring layer, and the average grain size in the first regionis smaller than the average grain size in the second region

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Satsumasendai, Japan

Yoshio Ohashi