Mitsubishi Denki Kabushiki Kaisha

Yoshio Nishimoto

Kiyoshi Hani

Minoru Kimura

Mutsuko Hayama

Tatsushi Nakai

Hiroshi Hishiki

Shohei Etoh

A heat insulation box body includes inner and outer boxes forming a shell of the heat insulation box body and triangular structural materials inserted in the shell held by close-contact by means of a vacuum. Further, at the time of disassembling the heat insulation box body after scrapping, a shell surface is cut and air is introduced into the inside of the shell to return the state of the shell to an atmospheric pressure state and then respective members are separated from each other.

Full vacuum heat insulation box body and method for producing and disassembling the same

A vacuum heat-insulating panel includes a porous core material formed from a mixture containing plastic foam powder and a filler in the form of flakes or a porous core material formed from a mixture containing plastic foam powder and thermoplastic resin powder; and a packaging material for packaging the core material, the inside of the package material being kept in a vacuum, the core material holding its shape. Rigid polyurethane foam may be used as the plastic foam. Mica flakes, plastic films each coated with thin metal film, metal foil or the like may be used as the filler. Styrene resin may be used as the thermoplastic resin.

Vacuum heat-insulating panel and method for producing the same

A vacuum heat-insulating panel includes: a porous core material formed from a mixture containing plastic foam powder and a filler in the form of flakes or a porous core material formed from a mixture containing plastic foam powder and thermoplastic resin powder; and a packaging material for packaging the core material, the inside of the package material being kept in a vacuum, the core material holding its shape. Rigid polyurethane foam may be used as the plastic foam. Mica flakes, plastic films each coated with thin metal film, metal foil or the like may be used as the filler. Styrene resin may be used as the thermoplastic resin.

Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Metal-core printed wiring board and a process for manufacture thereof

A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.

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Tokyo, Japan

Yoshio Nishimoto