Matsushita Electric Industrial Co., Ltd.

Yoshio Nakatani

Seiichi Nakatani

Minoru Yoshinaka

Hideyuki Yoshida

Mitsumasa Oku

Motoi Kitano

Eizo Asakura

Toshiya Hatta

Masaaki Sunohara

Tooru Tamura

Takahiro Manabe

Mikio Nozu

Akio Ito

Toru Tamura

A conductive composition containing at least zinc oxide whiskers. The conductive composition can be used to provide a conductive resing composition and a conductive coating composition, which have various uses, particularly in conductive layers, conductive supports or protective layers of electrophotographic photosensitive members.

Conductive resin composition containing zinc oxide whiskers having a

A conductive composition containing at least zinc oxide whiskers having a tetrapod structure. The conductive composition can be used to provide a conductive resin composition and a conductive coating composition, which have various uses, particularly in conductive layers, conductive supports or protective layers of electrophotographic photosensitive members.

Electrophotographic photosensitive member containing a conductive layer

A method of molding a plastic is initiated by injecting molten resin into a mold at a high pressure. The energy of the high pressure is partially stored in the form of elongation of tie bars of a molding machine. After the gate seals completely, the restoring force of the tie bars due to elastic deformation acts on the molded article as the mold article cools down. Each tie bar comprises a first member having a small modulus of elasticity and a second member. When the elongation of each tie bar is small, only the first member of small modulus of elasticity works. After the elongation reaches a certain amount of .DELTA.l.sub.1, the two members are connected parallel. As a result, the apparent modulus of elasticity of each tie bar increases rapidly. This makes it possible to mold a plastic with high dimensional accuracy.

Method of molding plastic and injection compression molding apparatus

An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon and attached at a part to the first substrate and attached at another part to the second substrate. A first group of electronic components including a heat-generating component are mounted on the film part attached to the first substrate. A second group of electronic components including a low-heat-resistive component are mounted on the film part attached to the second substrate. The gap between the first and second substrates is filled with a resin layer, preferably a foam resin layer, having a low heat conductivity so as to prevent a heat transfer from the heat-generating part to the low-heat-resistive part.

Electronic circuit module

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Chigasaki, Japan

Yoshio Nakatani