Toagosei Company, Ltd.

Fujimi Incorporated

Toagosei Chemical Industry, Co., Ltd.

Yoshio Mori

Kohsuke Tsuchiya

Shiro Kojima

Shuhei Takahashi

Shinichiro Takami

Kishiro Azuma

Koichi Adachi

Kenji Ito

Hisanori Tansho

Taiki Ichitsubo

Maki Asada

Tetsuya Tsuzuki

Masayoshi Okubo

Ken Takeda

Makoto Watanabe

Minoru Azuchi

Megumi Taniguchi

Takatoshi Mukai

Shinya Kanbe

This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.

Silicon wafer polishing composition

Provided is a polishing composition with which surface defects can be efficiently reduced. This invention provides a polishing composition comprising a water-soluble polymer M. The main chain of the water-soluble polymer Mis formed with a non-cationic region as its main structural part and a cationic region located at least at one end of the main chain. The cationic region has at least one cationic group.

Polishing composition and method for producing same

Provided is a polishing composition with which haze and surface defects can be reduced. This invention provides a polishing composition comprising a synthetic water-soluble polymer Mthat has a hydrophobic region at least at one end of its main chain. The hydrophobic region has at least one hydrophobic group derived from a polymerization initiator.

The polishing composition has a pH of 7 or more and is used in applications for polishing a silicon substrate. The polishing composition contains abrasive grains and a water-soluble polymer. The water-soluble polymer is a copolymer including a first monomer unit having a characteristic value P of 50-100 inclusive, and a second monomer unit having a characteristic value P of at least &#x2212;100 and less than 50. The characteristic value P is the result of subtracting an adsorption coefficient S2 of the abrasive grains obtained through a specific standard test B from a wettability coefficient S1 of the silicon substrate obtained through a specific standard test A.

Abrasive composition and method for producing semiconductor substrate

Provided is a polishing composition, which comprises abrasive grains, a water-soluble polymer, an aggregation inhibitor and water. The ratio R1/R2 is 1.3 or less, where R1 represents the average particle diameter of the particles present in the polishing composition and R2 represents the average particle diameter of the abrasive grains when the abrasive grains are dispersed in water at the same concentration as that of the abrasive grains in the polishing composition. The polishing composition can be used mainly for polishing the surface of a silicon substrate.

Composition for polishing purposes, polishing method using same, and method for producing substrate

A polishing composition is composed of a filtered diluted liquid obtained through an undiluted liquid-preparing step, an undiluted liquid-filtering step, a diluting step, and a diluted liquid-filtering step. In the undiluted liquid-preparing step, an undiluted liquid is prepared by mixing raw materials for the polishing composition. In the undiluted liquid-filtering step, the undiluted liquid is filtered. In the diluting step, the filtered undiluted liquid is diluted to obtain a diluted liquid. In the diluted liquid-filtering step, the diluted liquid is filtered. The polishing composition is used, for example, for polishing a silicon substrate material to produce a silicon substrate.

Polishing composition, manufacturing process therefor, process for production of silicon substrate, and silicon substrate

A novel retention aid is provided, which can realizes not only high retention but also excellent paper formation and is easy to use, in various papermaking processes. A composition for improving retention is provided, which comprises (A) a cationic water-soluble polymer and (B) an amphoteric water-soluble polymer. The component (A) preferably is a copolymer having a cation equivalent of 0.05 to 4.00 meq/g or one having a 0.5% salted viscosity of 30 to 200 mPa&#xb7;s. The component (B) preferably is either a copolymer comprising a cationic radical-polymerizable monomer unit, an anionic radical-polymerizable monomer unit, and a nonionic radical-polymerizable monomer unit, or an amphoteric water-soluble polymer obtained by polymerizing a cationic radical-polymerizable monomer with an anionic radical-polymerizable monomer in the presence of a polysaccharide. From the standpoint of attaining excellent formation, the component (B) preferably has a molar proportion of the cationic radical-polymerizable monomer unit to the anionic radical-polymerizable monomer unit (hereinafter referred to as Ca/An) satisfying Ca/An&#x3c;1.2.

Retention improving composition

A water-soluble thickener which is highly effective even in thickening strongly acidic aqueous solutions and has excellent stability in such solutions. It comprises a water-soluble copolymer having a weight-average molecular weight of 6,000,000 or higher obtainable by polymerizing a monomer mixture which comprises 2-acrylamido-2-methylpropanesulfonic acid and/or a salt thereof and acrylic acid and/or a salt thereof as essential components and optionally one or more other copolymerizable monomer components including the compound represented by the following Formula (1) and/or a salt thereof, wherein the 2-acrylamido-2-methylpropanesulfonic acid and/or a salt thereof represents 20 mol % or more of all the monomers. 

Water-soluble thickener and liquid acidic detergent

A composition is provided which comprises amphoteric polymers comprising, as constituent monomer units, a cationic monomer unit, an anionic monomer unit, and optionally a nonionic monomer unit and having a 0.5% salted viscosity of 10 to 120 mPa&#xb7;s, wherein said amphoteric polymers comprise a first amphoteric polymer satisfying the following expression (1) and a second amphoteric polymer satisfying the following expression (2) or a third amphoteric polymer satisfying the following expressions (3) and (4):Ca/An&#x2267;1&#x2003;&#x2003;(1)Ca/An&#x3c;1&#x2003;&#x2003;(2)Ca/An&#x2267;1&#x2003;&#x2003;(3)|(Ca&#x2212;An)&#x2212;(Ca&#x2212;An)|&#x2267;1.5&#x2003;&#x2003;(4)wherein Caand Anrespectively represent the total mole number of the cationic monomer units and the total mole number of the anionic monomer units in the first amphoteric polymer on a condition that the total mole number of all the constituent monomer units in the first amphoteric polymer is converted to be 100 mol; on a condition similar to the above, Caand An, and Caand An, respectively represent the total mole number of the cationic monomer units and the total mole number of the anionic monomer units in the second and third amphoteric polymers. The composition is excellent in various flocculation and dewatering performances for various types of sludge, in particular, for sludge high in ratio of excess sludge, and can be used for process yield improvement in papermaking process.

Composition comprising amphoteric polymeric flocculants

The invention provides a flocculant which in sludge dewatering gives flocs having an excellent balance among flocculating strength, filtration rate and moisture content, and a method of sludge dewatering with the flocculant. Namely, the flocculant is a polymeric flocculent which contains a copolymer having alkoxyalkyl units or a poly(alkylene oxide) unit and further having water-soluble monomer units; and the method of sludge dewatering includes adding the polymeric flocculant to a sludge after or without adding an inorganic flocculent or an organic cationic compound thereto and then dewatering the sludge.

Polymeric flocculant and method of sludge dehydration

An aqueous resin composition for coating a metal, which can form a coating film having excellent water resistance and also having high hardness and excellent workability even after being subjected to a pressurized steam treatment is provided. The aqueous resin composition comprises (A) an aqueous copolymer obtained by neutralizing with a base carboxyl groups in a copolymer which is obtained by copolymerizing (a) a macromonomer which is a copolymer of N-alkoxymethyl (meth)acrylamide monomer units and other .alpha.,.beta.-ethylenically unsaturated monomer units, having a radically polymerizable group at one end thereof, (b) .alpha.,.beta.-ethylenically unsaturated carboxylic acid, (c) hydroxyalkyl (meth)acrylate, and (d) other .alpha.,.beta.-ethylenically unsaturated monomers, in specific proportions, and (B) an amino resin.

Aqueous resin composition for coating metal, and radically polymerizable

An aqueous coating composition constitutes an aqueous graft copolymer and an amino resin, the graft copolymer being obtained by neutralizing, with a base, the carboxyl groups of a copolymer which is obtained by copolymerizing the following components (a), (b), (c) and (d) and which contains 3-30% of component (a), 3-20% of component (b), 5-40% of component (c) and 10-89% of component (d):

Aqueous coating composition

A process for producing an aqueous resin dispersion is disclosed, which comprises dissolving a macromonomer having a radical polymerizable group at the terminal thereof and an oil-soluble radical polymerization initiator in a hydrophobic vinyl monomer copolymerizable with the macromonomer to form a solution, emulsifying the solution in an aqueous medium in the presence of an emulsifying agent selected from (A) an alkali sulfosuccinate anionic surfactant and (B) a surfactant comprising from 2 to 98% by weight of (i) an alkali sulfonate anionic surfactant other than (A) or (ii) an alkali sulfuric ester anionic surfactant, and from 98 to 2% by weight of a nonionic surfactant having an HLB value of 10 or more, and copolymerizing the macromonomer and the vinyl monomer at an elevated temperature. The aqueous resin dispersion has a high content of a graft polymer with a reduced content of unreacted macromonomer.

Process for producing aqueous resin dispersion

A process for producing a macromolecular monomer, which comprises anionic polymerization of a (meth)acrylic acid ester monomer by using, as a polymerization initiator, a compound represented by the following general formula [I]: ##STR1## wherein M.sup.+ is a quaternary ammonium ion; .phi.is a phenylene group; R.sub.1 and R.sub.2 are each an electron withdrawing group stabilizing the carbanion C.sup.-, or one of them is said electron withdrawing group and the other is an alkyl group of 1-6 carbon atoms or a phenyl group; and n is an integer of 0-6.

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Kiyosu, Japan

Yoshio Mori