Toshiba Memory Corporation

Kioxia Corporation

Yoshio Mizuta

Masato Suzuki

Nobuhiro Komine

Manabu Takakuwa

A bonding apparatus according to an embodiment includes a first chuck, a second chuck, and a pushpin arranged in a center portion of the second chuck. The first chuck includes a first area and a second area in a plane view. The first chuck includes a first rib arranged to divide the first area and the second area from each other in the plane view. The first area includes an area that overlaps the pushpin in the plane view. The second area encircles an outer perimeter of the first area in the plane view. The first chuck has a plurality of pins arranged at intervals in the second area, and has no pin in the area of the first area that overlaps the pushpin in the plane view.

Bonding apparatus and method of manufacturing semiconductor device

An apparatus includes a first and second stages. The first and second stages respectively hold a first and second substrates. The second stage being opposed to the first stage. A stress application portion applies a stress to the first substrate based on a first magnification value. A calculator calculates the first magnification value based on a flatness of the first substrate and a first equation. The first equation represents a relation between flatness of a third substrate, a second magnification value, and an amount of pattern misalignment between the third substrate and a fourth substrate bonded to the third substrate. A controller controls the stress application portion to apply a stress to the first substrate on the first stage based on the first magnification value while the first and second substrates are bonded to each other.

Bonding apparatus, bonding method, and method for manufacturing semiconductor device

According to an embodiment, focus sensitivity information in which focus sensitivity expressing a relation between an aberration correction value set in an exposure device and a best focus when a pattern is formed on a first substrate by exposure of the exposure device using the aberration correction value, and the pattern are correlated is input. Moreover, on the basis of the focus sensitivity information and a surface height difference of a second substrate, the aberration correction value in which best focuses for a pattern group to be formed on the second substrate by exposure satisfy a first condition is calculated. In addition, the second substrate is exposed by the exposure device using the aberration correction value satisfying the first condition.

Exposure method, exposure system, and manufacturing method for semiconductor device

In an imprinting apparatus according to one embodiment, rear surfaces of first and second templates are suctioned. A correction information calculating device calculates a second response coefficient of the second template out of first response coefficients based on a flatness relational expression and flatness of the second template. The first response coefficients are actual amounts of positional slippage of the first template from a first input adjustment value. The flatness relational expression indicates a relationship between flatness of the first template and the first response coefficients. A shape and a size of the second template are adjusted using the second response coefficient.

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Yokkaichi, Japan

Yoshio Mizuta