Asahi Kasei Kogyo Kabushiki Kaisha

Asahi Kasei Kabushiki Kaisha

Yoshio Matsuoka

Akihiko Ikeda

Hideo Ai

Yasuhiro Kataoka

Kanichi Yokota

Yoko Tanizaki

Yoshiaki Kawai

Keiko Hata

Hideo Koizumi

Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.

Polyamic acid ester

The present invention provides photosensitive compositions which comprise polyimide precursors having a chemical structure selected from several specific chemical structures and/or specific amide bond density and are adjusted so that the film obtained by applying and drying the composition may exhibit a specific absorbance to light. The polyimide film obtained by heat-curing the above photosensitive composition exhibits excellent physical properties and water resistance, and has high adhesive strength to epoxy resins, inorganic materials and metals.

Process for forming a polyimide pattern with photosensitive composition for i-line stepper

Photosensitive polyimide precursor compositions processable by exposure

Polyimide precursor and photosensitive composition containing the same

A process for preparing a polyamide which comprises polycondensing a dicarboxylic acid and a diamine by using a combination of at least one phosphine and at least one disulfide as the condensing agent.

Process for preparing polyamide with organic phosphine/organic disulfide

A process for preparing polyamides which comprises polycondensing dicarboxylic acids having the following general formula and diamines by using carbodiimides as the condensing agent. ##STR1## wherein X is a group having a valence of (m+2), and C.sub.6-20 carbocyclic group, C.sub.3-20 heterocyclic group, C.sub.2-20 alkyl group, or C.sub.2-20 alkenyl group, the group having at least one carbon-carbon double bond in the position of conjugating to carboxylic acid radical or the group having an .alpha.,.beta.-unsaturated ketone structure;

Polyamide preparation from polycarboxylic acid and polyamine with

Novel copolymers having a weight average molecular weight of 500 to 5,000,000 and comprising 1 to 99% by weight of a recurring unit represented by the formula (I), 1 to 99% by weight of a recurring unit represented by the formula (II) and 0 to 98% by weight of a recurring unit represented by the formula (III): ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group; X is a hydrogen atom, a methyl group or a phenyl group; Y is a hydrogen atom, a halogen atom, a methyl group, a phenyl group or a cyano group; and Z is a phenyl group, a phenyl group substituted by at least one alkyl group having 1 to 8 carbon atoms, a polycyclic aromatic hydrocarbon group having 10 to 20 carbon atoms, a cyano group, --COOR.sup.2 (in which R.sup.2 is an alkyl group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms), --COR.sup.3 (in which R.sup.3 is an alkyl group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms), a nitro group, a pyridyl group, ##STR2## (in which R.sup.3 has the same meaning as defined above), or a halogen atom. The above-mentioned copolymers are useful as resist materials which are sensitive to high-energy radiations.

Growing community of inventors

Fuji, Japan

Yoshio Matsuoka