Matsushita Electric Industrial Co., Ltd.

Yoshio Maruyama

Shinji Kadoriku

Takaaki Higashida

Hiroshi Yutani

Osamu Hikita

Hiroshi Yamauchi

Yoshinori Wada

Takahiro Matsuo

Osamu Yamazaki

Toshiaki Yamauchi

Kazuei Kenmochi

Daisuke Nagano

Naomi Kuromoto

Tokiharu Nakagawa

Kazuo Inoue

Mikiya Nakata

Kazuhiro Mori

Shoriki Narita

Hidenori Miyakawa

Yoshiyasu Honma

Tadashi Sakairi

Takashi Akiguchi

Haruhiro Yuki

Shoshi Kabashima

Yoshihiro Kawasaki

Akinobu Katayama

Keizo Matsumura

Eizi Itemadani

A high-definition plasma display panel and its manufacturing method. Luminance is increased by increasing surface area of a phosphor layer without reducing a discharge space of a discharge cell. For formation of the phosphor layer, an organic binder is made by dissolving, through heating, at least an organic solvent and a plurality of resins of different solubilities with respect to the organic solvent, and phosphor paste is made of this organic binder and phosphor particles. A recessed and projected part is formed of spaces formed by burning out gelled substances formed by the resin with low solubility in a phosphor film, thereby increasing the surface area of the phosphor layer. Consequently, increased luminance is obtained.

Plasma display panel and its manufacturing method

An optical disk molding apparatus and method are provided which prevent data formed on a molded object from being damaged and prevent quality deterioration of the molded object. There are provided a mold moving device, a first gas supply device, and a controller, whereby a first release space part is formed by opening molds from a mold clamp state by a movement distance not damaging a data transferred face of the optical disk, and a gas is supplied to the first release space part at a point in time when the first release space part is formed, thereby totally separating the optical disk and a stamper from each other. No damage is caused to a data transferred face at the point in time when the first release space part is formed. Since separation between the optical disk and the stamper is performed via pressure of the gas after the first release space part is formed, data is prevented from being damaged over the data transferred face of the optical disk in its entirety.

Optical disk molding apparatus and method

A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Method of manufacturing article having electronic circuit

A stamper protecting layer is interposed between a mold and a stamper of an optical disk molding apparatus, so that forces generated by extension and shrinkage of the stamper relative in a diametrical direction of the stamper to the mold when an optical disk is molded are absorbed by the stamper protecting layer, with this arrangement, the stamper is prevented from being deformed. Accordingly quality and production of the optical disks are improved.

Stamper protecting layer for optical disk molding apparatus, optical disk molding apparatus and optical disk molding method using the stamper protecting layer

The present invention is a part retainer for housing and retaining various electronic and mechanical parts wherein a retaining unit has an engaging piece that stably stops at both a position at which it protrudes toward the opening of a part housing space and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece prevents the part housed in the housing space from falling out.

Part retainer for holding a part

A part holder comprising holding members (,) extending upward on a base (,) to hold a part (,), insertion holes (,) penetrating the base (,) and passing lead wires (,) of the part (,) through when the part (,) is held by the holding members, and supports (,) extending downward on the base (,) and adapted to be supported on a substrate (,), on which a predetermined electric circuit is formed.

Part holder, substrate having same, and method of manufacturing same

A stamper protecting layer is interposed between a mold and a stamper of an optical disk molding apparatus, so that forces generated by extension and shrinkage of the stamper in a diametrical direction of the stamper relative to the mold when an optical disk are molded is absorbed by the stamper protecting layer. With this arrangement, the stamper is prevented from being deformed. Accordingly quality and production of the optical disks are improved.

Stamper protecting layer for optical disk molding apparatus

A module is provided for a packaged IC designed to radiate heat by sealing the packaged IC. At least outer lead parts the packaged IC which are mounted on an electronic circuit board are sealed by a sealing material of a high thermal conductivity to form a sealing part.

Module for packaged IC

A molding apparatus for light-permeable articles which includes a nozzle that is movable up and down. A suction path and a suction device connected to the suction path are provided so as to suck a gas at a contact face of a sprue bush and its vicinity during the up/down movement of the nozzle. Accordingly, foreign substances, invading the mold can be sucked up before the apparatus performs a molding operation. Therefore, foreign substances are prevented from being mixed into the molded product. The molded product is accordingly improved in quality and yield.

Molding apparatus and molding method for light-permeable articles

A component carrier assembly includes component holders each for holding a component therein and connected to one another in a form of a tape carrier. Each holder is provided with a cavity to accommodate the component, a closure for shutting an opening of the cavity, and a device for securing the lid structure in a closed position. An apparatus for feeding the component carrier includes a device for transferring the component carrier, a device for forcibly opening a closure of a component holder transferred to a predetermined position, and a device for forcibly closing the closure of the component holder after a component is removed from the cavity.

Component collective and component collective feeding apparatus

The separation of a lower mold from an upper mold in an injection molding machine is either temporarily paused or carried out at a lower speed so as to maintain deformation of a thin component within a permissible range, while a jet of air is applied to help remove the thin component from the upper mold. Also, the ejecting operation of the thin component is either temporarily paused or carried out at a lower speed before the deformation of the thin component exceeds the permissible limit while a jet of air is applied to help remove the thin component from the lower mold.

Injection molding method for thin components

A component collective includes component holders respectively holding components therein and connected to one another in the form of a tape carrier. Each of holders is provided with a cavity to accommodate the component, a lid for shutting an opening of the cavity, and a keeping device for keeping the lid at a closed position. An apparatus for feeding the component collective includes a device for transferring the component collective, a device for forcibly opening the lid means of the component holder transferred to a predetermined position, and a device for forcibly closing the lid of the component holder after a component is removed from the cavity.

A mold clamping device includes a frame, a fixed base for supporting a first mold, the fixed base being fixedly mounted on the frame, a movable base for supporting a second mold, the movable base being movably mounted on the frame in confronting relation to the fixed base, first means on the frame for driving the movable base to move rectilinearly toward and away from the fixed base, a cam follower supported on the movable base, a cam supported on the frame and having a cam surface held in contact with the cam follower, and second means for driving the cam in a mold clamping stroke to displace the cam follower for enabling the movable base to clamp the second mold firmly against the first mold on the fixed base, the cam surface being defined by a cam follower displacement curve having a gradient which is greater at an initial stage of the mold clamping stroke and becomes smaller as the mold clamping stroke progresses. When the cam is driven by the second means, the cam follower is displaced thereby to clamp the first and second molds together. The cam is small in size to make the mold clamping device small in size, and is high in rigidity to allow itself to be driven by a small force.

Mold clamping device for molding machines

An injection molding valve nozzle comprises a nozzle head with a gate dividing a flow passage into two sections, a spool slidably attached to the gate and including axial grooves in its outer surface and a spring for urging the spool rearward. The valve nozzle is so arranged that the gate is closed by the spool because the grooves do not reach the gate upon lower pressure of resins below a certain level, but that the spool may slide forward to extend the grooves over the gate, communicating a front passage with a rear passage upon higher resin pressure above a certain level and that when the pressure differential between the front and rear passages decreases or the resin pressure descends below a certain level, the spool slides rearward by the spring for closing the gate. Thus, the gate is closed by the spool until the resin pressure rises up to a certain level. The engaging portions of the gate and the spool may be made long depending on the pressure and viscosity of the resin so that the gap between the gate and the spool can be determined to be approximately 10 .mu.m. Therefore, easy manufacturing of the valve nozzle is realized. Further, although the resins flow into the gap, the spool surely slides forward during injection to spout the resin by the resin from the rear without remaining, deterioration and dissolution. Therefore, the life of the valve is improved.

Growing community of inventors

Kyoto, Japan

Yoshio Maruyama