Seiko Epson Corporation

Yoshio Maeda

Shinya Aoki

Masahiro Fujii

Takashi Yamazaki

Mitsuro Atobe

Keigo Iizawa

Yusuke Kinoshita

Hiroshi Komatsu

Keiichi Mukaiyama

Michiaki Takagi

Hiroyuki Maruyama

Tadaaki Hagata

Kazuhiko Akahane

Shouichi Komatsu

An electronic device includes a first base body, a second base body, a third base body held between the first base body and the second base body, a first functional element disposed in a first cavity surrounded by the first base body and the third base body, and a second functional element disposed in a second cavity surrounded by the second base body and the third base body.

Electronic device, electronic apparatus, and method of manufacturing electronic device

A surface acoustic wave chip formed with an inter-digital transducer entirely over a piezoelectric substrate. In the surface acoustic wave chip, the inter-digital transducer is extended to a rim of the piezoelectric substrate, and a partition section is provided all the way to the rim of the piezoelectric substrate to partition an electrode pattern to derive two of the inter-digital transducers.

Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same

A surface acoustic wave device includes a surface acoustic wave (SAW) chip and a cover that are bonded in a body by bonding a metal bonding portion of the SAW chip and a metal bonding portion of the cover and bonding extraction electrodes of the SAW chip and connection electrodes of the cover so as to hermetically seal IDT electrodes disposed on a main surface of a piezoelectric substrate of the SAW chip within a space defined between the SAW chip and the cover. The IDT electrodes and external electrodes on an upper surface of an insulating substrate of the cover are electrically connected to each other through conductive materials formed in through-holes.

Surface acoustic wave device and method of manufacturing the same, IC card, and mobile electronic apparatus

The invention provides a piezoelectric substrate in the form of a rectangular plate in which a Rayleigh wave is propagated, and an IDT and a reflector are provided by forming interdigital electrodes on the piezoelectric substrate. At least an end face on a shorter side of the piezoelectric substrate on a top side thereof is formed as a vertical smooth surface that is substantially in parallel with a conductor strip at an end of the reflector in the position of an imaginary node of a stress wave exiting the conductor strip, thereby providing a reflecting end face to reflect the stress wave.

Surface acoustic wave device and method of manufacturing the same

In a substrate in which a reflection coefficient &#x3b3; of a surface acoustic wave per electrode is small, the invention obtains a Q value or a CI value level, which is equivalent to or higher than that of a related art product, at a device size which is equivalent to the related art product which addresses the problem that the size of a surface acoustic wave resonator becomes larger. A surface acoustic wave resonator includes one interdigital transducer to excite a surface acoustic wave in a propagation direction x on a piezoelectric plate and a pair of reflectors arranged on both sides thereof in the propagation direction. The interdigital transducer is divided into three regions. The electrode fingers of the interdigital transducer of each region are formed at a fixed pitch which differs within 2%. The surface acoustic wave resonator possesses a single peak response. The form in which a vibration displacement envelope amplitude in the interdigital transducer region is normalized is a form which takes a maximum value 1 at the center position, which smoothly takes a value in a range of 0.33 to 0.53 at a position &#xbc; from both ends, and which smoothly takes a value in a range of 0.048 to 0.177 at positions at both ends.

Surface acoustic wave resonator with an interdigital transducer divided into regions having a different fixed pitch

A manufacturing method for a device having an electrostatic actuator for example inkjet head, whereby warping of the diaphragms does not occur as a result of anodic bonding is provided. The method comprises the steps of etching a first substrate on the first surface thereof to form a concave portion and a diaphragm provided in bottom walls of the concave portion, forming an electrode on a second substrate, and anodically bonding the second substrate to a second surface of the first substrate, opposite the first surface, such that the electrode is aligned adjacent to the diaphragm with a gap therebetween. The bonding temperature of the anodically bonding step is set within a temperature range whereby the contraction of the first substrate after bonding is equal to or greater than the contraction of the second substrate.

Growing community of inventors

Fujimi-machi, Japan

Yoshio Maeda