Mitsubishi Denki Kabushiki Kaisha

Yoshio Kimura

Hiroshi Mitsuoka

Isamu Hosono

A vapor cooled semiconductor device which comprises an envelope having at least one aperture, at least one semiconductor element enclosed therein, an electrode contacting the semiconductor element and exposed across the aperture of the envelope, an expandable diaphragm disposed through an insulator between the electrode and the wall of the envelope to seal the gap therebetween, spherical spring plates disposed outside the envelope and arranged to support the semiconductor element through the electrode under pressure, and a liquid coolant enclosed in the closed envelope, with space provided therein, whereby the semiconductor element may be cooled by the latent heat of vaporization of the liquid coolant.

Vapor cooled semiconductor device having an improved structure and

A heat transferring apparatus comprising an evaporator and a condensor disposed thereabove, a conduit connecting the evaporator and condensor, and a plurality of fine fabric tubes made of glass fiber or the like disposed in the conduit, the tube walls being permeable to the coolant liquid phase of a coolant being used for cooling an electric or heat generating device in the evaporator, wherein a coolant gas vaporized by the latent heat of gasification in the evaporator is fed to the condensor through the conduit by the increasing pressure caused by the gasification and the coolant gas is then condensed by discharging the latent heat in the condensor, the condensed coolant liquid flowing down into the evaporator under force of gravity and this cycle is repeated to cool the electric or heat generating device. The feedback of the condensed coolant liquid is smoothly performed because of the permeable fabric tube in the conduit allowing the liquid coolant supported above the upflowing gas to permeate thereinto whereby frictional contact between the liquid and gas coolant phases is precluded and the liquid coolant is able to be returned freely through the fabric tubes to the evaporator.

Heat transferring apparatus utilizing phase transition

A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.

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Amagasaki, Japan

Yoshio Kimura