Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tel Kyushu Limited

Kabushiki Kaisha Toshiba

Sinfonia Technology Co., Ltd.

Yoshio Kimura

Masami Akimoto

Issei Ueda

Nobuaki Matsuoka

Shinichi Hayashi

Hikaru Ito

Yasushi Hayashida

Hiroshi Tomita

Kunie Ogata

Satoshi Morita

Norio Semba

Michio Tanaka

Ryouichi Uemura

Koki Nishimuko

Takahiro Kitano

Noriyuki Anai

Osamu Hirakawa

Keizo Hasebe

Takahiro Okubo

Yuuji Matsuyama

Akira Miyata

Takayuki Toshima

Yuji Matsuyama

Tsutae Omori

Tetsuo Fukuoka

Yasuhiro Sakamoto

Mitsuru Ushijima

Shoichi Terada

Kazuhiko Ito

Mitiaki Matsushita

Kiyohisa Tateyama

Naruaki Iida

Shigenori Ozaki

Nobuo Konishi

Shinji Nagashima

Masatoshi Kaneda

Koji Harada

Masanori Tateyama

Seiki Ishida

Gousuke Shiraishi

Yasuhiro Oshima

Yasunori Kawakami

Kenichi Kagawa

Yuji Yoshimoto

Takahide Fukuda

Kouji Harada

Hiroyuki Iino

Tomoaki Kurakazu

Shinichi Gomi

Junichi Nagata

Norikatsu Sato

Tetsuro Nakahara

Kunie Tsunematsu

Seiji Nakashima

Hidehiko Kamiya

Nobuyuki Jinnai

Shinichiro Izumi

This resist pattern forming method comprises: a step for coating a substrate with a chemically amplified resist; a subsequent step for forming a latent image of a pattern by exposing the resist film on the substrate; a subsequent step for irradiating the exposed resist film selectively with infrared light from a first heating source having wavelengths 2.0-6.0 &#x3bc;m; a subsequent step for heating the substrate by means of a second heating source that is different from the first heating source for the purpose of diffusing an acid that is produced in the resist film by exposure; and a subsequent step for forming a pattern of the resist film by supplying a developer liquid to the substrate. Consequently, roughening of sidewalls of the resist pattern can be suppressed.

Resist pattern forming method, coating and developing apparatus and storage medium

A cell culture container characterized by being equipped with a container main body and a flat plate attached onto one surface of the container main body, wherein the container main body is equipped with an inflow port through which a liquid can flow into the container main body, a passage through which the liquid flowing into the container main body from the inflow port can pass, and an outflow port through which the liquid passing through the passage can flow out from the container main body, and wherein, on the bottom surface of the passage, multiple cell-seeding areas in which cells passing through the passage can be seeded are arranged side by side along the passage.

Cell culture container

The present invention is an imprint system including an imprint unit transferring a transfer pattern to a coating film formed on a substrate using a template having the transfer pattern formed on a front surface thereof to form a predetermined pattern in the coating film, the imprint system including: a substrate carry-in/out station connected to the imprint unit, capable of keeping a plurality of the substrates, and carrying the substrate into/out of the imprint unit side; and a template carry-in/out station connected to the imprint unit, capable of keeping a plurality of the templates, and carrying the template into/out of the imprint unit side at a predetermined timing.

Imprint system, imprint method, and non-transitory computer storage medium

The present invention is a template treatment apparatus forming a film of a release agent on a template having a transfer pattern formed on a front surface thereof, the template treatment apparatus including: a treatment station forming a film of a release agent on the front surface of the template; and a template carry-in/out station capable of keeping a plurality of the templates, and carrying the template into/out of the treatment station, wherein the treatment station includes: a cleaning unit cleaning the front surface of the template; a coating unit applying a release agent to the cleaned front surface of the template; a heating unit baking the applied release agent; and a carry unit carrying the template to the cleaning unit, the coating unit, and the heating unit.

Imprint system for performing a treatment on a template

A coating/developing device includes a processing block having a plurality of coating unit blocks stacked and a developing unit block stacked on the coating unit blocks. Each of the unit blocks is provided with a liquid processing unit for coating a liquid chemical on a substrate, a heating unit for heating the substrate, a cooling unit for cooling the substrate and a transfer unit for transferring the substrate between the units. The liquid processing unit is provided with a coating unit for coating a resist liquid on the substrate, a first bottom antireflection coating (BARC) forming unit for coating a liquid chemical for a BARC on the substrate before the resist liquid is coated thereon, and a second BARC forming unit for coating a liquid chemical for the BARC on the substrate after the resist liquid is coated thereon.

Coating/developing device and method

Provided is a coating and developing apparatus composed of an assembly of plural unit blocks. A first unit-block stack and a second unit-block stack are arranged at different positions with respect to front-and-rear direction. Unit blocks for development, each of which comprises plural processing units including a developing unit that performs developing process after exposure and a transfer device that transfers a substrate among the processing units, are arranged at the lowermost level. Unit blocks for application, or coating, each of which comprises plural processing units including a coating unit that performs application process before exposure and a transfer device that transfers a substrate among the processing units, are arranged above the unit blocks for development. Unit blocks for application are arranged in both the first and second unit-block stacks. Unit blocks for application which a wafer goes through are determined depending on the layering positional relationship between an antireflective film and a resist film. An exposed wafer goes only through the unit block for development without going through any one of the unit blocks for application.

Coating and developing apparatus

A substrate transfer system to reduce total processing time by transferring a substrate at a first delivery stage to a process block where processing can be carried out earliest. The substrate processing apparatus includes a first transfer device delivering a wafer with respect to a substrate carrier, and a second transfer device delivering a wafer between a plurality of process blocks and the first transfer device via a first delivery stage, to transfer the wafer with respect to the process blocks. The process block where there is no wafer or where processing of the last wafer within the relevant process block will be completed earliest is determined based on processing information of the wafers from the process blocks, and the wafer of the first delivery stage is transferred by the second transfer device to the relevant process block. This ensures smooth transfer of the wafer to the process block.

Substrate processing apparatus and substrate processing method

A resist pattern forming method using a coating and developing apparatus and an aligner being connected thereto which are controlled to form a resist film on a surface of a substrate with a base film and a base pattern formed thereon, followed by inspecting at least one of a plurality of measurement items selected from: reflection ratio and film thickness of the base film and the resist film, line width after a development, an accuracy that the base pattern matches with a resist pattern, a defect on the surface after the development, etc. A parameter subject to amendment is selected based on corresponding data of each measurement item, such as the film thickness of the resist and the line width after the development, and amendment of the parameter is performed. This results in a reduced workload of an operator, and the appropriate amendment can be performed.

Substrate processing method and apparatus

A buffer tank for use in a liquid treatment apparatus applying a liquid treatment to a substrate surface by supplying thereto a treating liquid from a nozzle, the buffer tank is provided in a flow path of the treating liquid from a supply tank of the liquid to the nozzle, the buffer tank including an inlet port for introducing the treating liquid supplied from the supply tank into a buffer tank body, a first accumulation region in the buffer tank body for holding the treating liquid introduced into the buffer tank, a first vent port for discharging bubbles accumulated in the first accumulation region, a filter through which the treating liquid in the first accumulation region passes, the filter filtering the treating liquid, and a supplying port for supplying the treating liquid filtered with the filter to the nozzle.

Buffer tank, intermediate accumulation apparatus, liquid treatment apparatus, and supplying method of treating liquid

A process system includes a plurality of processing modules each processing a substrate with a process liquid. There is disposed a dispensing mechanism that dispenses the process liquid to the vertically arranged modules. The dispensing mechanism is provided with a process liquid supply source, and pumps corresponding to the respective processing modules. Each pump temporarily stores therein the process liquid which has been pressure-fed through a riser piping from the process liquid supply source by a pressing apparatus, and delivers the process liquid from an outlet. There are disposed nozzles each having a discharge port and discharging the process liquid to the corresponding processing module. Delivery pipings connecting the outlets of the pumps with the discharge ports of the corresponding nozzles have identical length to each other.

Substrate processing system and method of controlling the same

A heating apparatuscomprises a housing; a flat heating chamberwhich is provided in the housingand adapted to heat a wafer W used as a substrate, with one side of the heating chamberopening for carrying in and carrying out the wafer; and a heating platesprovided in the heating chambersuch that the wafer W can be heated from both above and below. A cooling plateis provided in the housinglocated in the vicinity of the opening of the heating chamber, for cooling the wafer W after being heated by the heating plates. Additionally, a carrying means is provided in the housingfor carrying the wafer W between an upper position of the cooling plateand the interior of the heating chambersuch that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber

Heating apparatus, and coating and developing apparatus

Resist pattern forming method

Growing community of inventors

Koshi, Japan

Yoshio Kimura