Mitsubishi Materials Corporation

Mitsubishi Metal Corporation

Samsung Sdi Co., Inc.

Mitsubishi Kinzoku K.k.

Yoshio Kanda

Yoshirou Kuromitsu

Toshiyuki Nagase

Hideaki Yoshida

Kunio Sugamura

Tadaharu Tanaka

Masafumi Hatsushika

Hideaki Sakurai

Takuo Takeshita

Hiroto Uchida

Masato Otsuki

Hirokazu Tanaka

Kenji Morinaga

Young Soo Seo

Seung Jae Chung

Satoru Mori

Yoshiro Kuromitu

Ryuji Uesugi

Hyun Sub Lee

Joon Min Kim

Young Cheul Kang

Eun Gi Heo

One object of the present invention is to provide a blade for forming ribs that is able to improve wear resistance; in order to achieve the object, the present invention provide a blade for forming ribs that forms ribs either on the surface of a substrate or via an undercoating layer on the surface of a substrate by moving a blade body in a fixed direction relative to a paste film in the state in which comb teeth formed on at least a portion of the periphery of said blade body are penetrated into said paste film formed on the surface of said substrate to plasticly deform said paste film; wherein, the surface of said comb teeth formed on said blade body that makes contact with said paste film is coated with a compound layer in which hard particles are dispersed in a metal.

Blade with comb teeth coated with a compound layer for forming ribs and its production method

A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

Ceramic circuit board with heat sink

Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.

Highly heat-radiating ceramic package

Structure of ceramic superconductive wiring and process of fabrication

An insulating substrate is used for fabrication of a thick film circuit and comprises a foundation of aluminum nitride and a surface film structure provided on the foundation, in which the foundation contains at least one oxidizing agent selected from the group consisting of an yttrium oxide and a calcium oxide ranging from 0.1% to 10% by weight for enhancing a stiffness of the foundation, and in which the surface film structure is of the multi-level surface film structure having a lower surface film of an aluminum oxide rapidly grown on the foundation in the presence of the oxidizing agent and an upper surface film containing a silicon oxide and a substance selected from the group consisting of a zirconium oxide, a titanium oxide and a boron oxide for enhancing the resistivity against a firing operation.

Substrate used for fabrication of thick film circuit

An insulating substrate is used for fabrication of a thick film circuit provided with a conductive pattern made from a paste containing glass frits, and comprises a foundation containing an aluminum nitride and incidental impurities, and a multi-level surface film structure provided between the foundation and the conductive pattern and having a lower surface film of an aluminum oxide provided on a surface of the foundation, an intermediate surface film provided on the lower surface film and formed of a substance having a relatively small acidity and an upper surface film provided on the intermediate surface film and formed of a substance having a relatively large acidity, in which the substance with the large acidity rapidly reacts with the frits in a firing stage for enhancing the adhesion of the conductive pattern but the substance with the relatively small acidity restricts the consumption thereof, so that the total thickness of the multi-level film structure is decrased and, accordingly, the heat radiation capability is improved.

Growing community of inventors

Saitama, Japan

Yoshio Kanda