Nec Corporation

Renesas Electronics Corporation

Yoshio Kameda

Masayuki Mizuno

Yoshihiro Nakagawa

Koichiro Noguchi

Koichi Nose

Riki Eto

Wemer Wee

Masamoto Tago

Manabu Kusumoto

Takeo Nozaki

Hiroaki Ohkubo

Masayuki Furumiya

Hisashi Ishida

Yusuke Kikuchi

Kenichiro Fukushi

Satoshi Morinaga

Fuyuki Okamoto

Shinichi Yorozu

Toshinobu Ono

Chenpin Hsu

A control customization systemcustomizes a plant control. A profilerpredicts actions of a user depending on situations of the plant or the user. A plannerdetermines an appropriate set of objectives which represent tasks desired by the user, and objective terms representing elements for controlling the plant so as to realize the objectives, and tunes the objective terms based on predictions of the profiler

Control customization system, control customization method, and control customization program

A model estimation system estimates a model of a system represented by an ordinary differential equation with all coefficients being non-zero, and with which input data and a state at each time can be obtained. When an order of the ordinary differential equation and input data and a state at multiple past times in the system are inputted, a model expression construction unit constructs an expression representing a model by using a first matrix that is a matrix according to the order and has only some elements as unknown elements and a second matrix that is a matrix according to the order and has only some one element as an unknown element. A model estimation unit uses input data and a state at multiple past times, to estimate the model by learning unknown elements of the first matrix and the unknown element of the second matrix.

Model estimation system, method, and program

An expert model unitgenerates predicted expert control actions based on an expert model which is a machine learning model trained using data collected when an expert operated a plant which is a control target or a plant of the same or similar characteristics. A transformerconstructs metrics or error measures involving the predicted expert control actions from the expert model unitas an objective term. A combinercollects different objective terms from the transformerand a learner which outputs machine-learning models as objective terms and computes an optimal set of weights or combinations of the objective terms to construct an aggregated cost function for use in an optimizer.

Control objective integration system, control objective integration method and control objective integration program

A vehicle control system for controlling driving of a vehicle reflecting an environment and a characteristic of a user, while suppressing increase in learning time, is provided. The vehicle control system includes classification means for classifying, by using one or more attributes selected from accumulation means for accumulating data including attributes relating to driving of a vehicle, driving properties included in the data, learning means for learning a model representing the driving property, for each of types that are a result of classification by the classification means, and control information determination means for determining, by using the model learned for the type associated with a value of the attribute at time of driving of a control target vehicle, control information for the driving.

Vehicle control system, vehicle control method, and program recording medium

Provided are a reference scale and dimension measurement system that make it possible to maintain accurate measurement even if the reference scale is not disposed or projected on a measurement surface. A dimension measurement device according to the present invention is provided with: a reference scale extraction means for extracting, from photographed image data including a reference scale that includes a film that has a pattern for displaying a length reference formed on the surface thereof and a lens that is in contact with the film, an image in which an image of the length reference is formed on the basis of the relationship between a pattern function expressing the length reference projected onto the lens according to variation in a prescribed angle between the reference scale and the optical axis of a photography device and an image formation color function indicating the image of the length reference formed on the imaging device; an object of measurement extraction means for extracting an object of measurement image from photographed image data including the reference scale; and a dimension calculation means for calculating a dimension of the object of measurement on the basis of a dimension of the image in which the image of the length reference is formed and the image of the object of measurement.

Dimension measurement device, dimension measurement system, and dimension measurement method

An information processing device according to the present invention, includes: an information accumulation unit which receives and accumulates control-target information that includes information related to a control target and an environment including the control target; a prediction-equation-set learning and generation unit which learns and generates a prediction-equation set to be used for determination of an operation quantity of the control target based on the control-target information accumulated in the information accumulation unit; and an operation-quantity determination unit which receives input information needed for determination of an operation quantity of the control target, constructs a predictive-control model of the control target based on the prediction-equation set, the control-target information accumulated in the information accumulation unit, the control-target information received, and the input information, and determines an operation quantity used for control of the control target.

Information processing device, predictive control method, and recording medium

A redundant computing system is composed of two systems: a first arithmetic processing unit (A-system) and a second arithmetic processing unit (B-system) having the same functions. A diagnosis control unit performs diagnosis of one system while the other system is performing arithmetic processing operation. The diagnosis control unit controls the input to the first and second arithmetic processing units by way of an input control unit according to the diagnosis operation, and an output control unit controls the output from the first and second arithmetic processing units according to the diagnosis result. After termination of the diagnosis, a value is copied from a storage unit of the system which has not been diagnosed to a storage unit of the system which has been diagnosed, and the redundant computing system resumes the redundant operation.

Redundant computing system and redundant computing method

A semiconductor inspection apparatus comprising: a plurality of wafer stages, provided independently for each of a plurality of laminated semiconductor wafers, that directly or indirectly secure the corresponding semiconductor wafers and that possess a mechanism for positioning the corresponding semiconductor wafers; and a probe card, arranged outside or in between the plurality of laminated semiconductor wafers so as to face the semiconductor wafers, that transmits a signal or power to the plurality of semiconductor wafers.

Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method

A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.

Semiconductor inspecting device and semiconductor inspecting method

A semiconductor device () includes a semiconductor wafer () on which a plurality of semiconductor chip forming regions (A) is formed, a circuit section () which is provided within each of the semiconductor chip forming regions (A) of the semiconductor wafer (), a control circuit section (), provided within each of the semiconductor chip forming regions (A) and connected to the circuit section (), that controls electric power supplied to the circuit section (), a power supply line () connected to the plurality of control circuit section (), and a reference power line () connected to the plurality of control circuit section (). In each of the control circuit sections (), a voltage of electric power supplied from the power supply line () is controlled on the basis of a reference voltage from the reference power line ().

Semiconductor device and method of testing the same

A semiconductor test apparatus, semiconductor device, and test method are provided that enable the realization of a high-speed delay test. Semiconductor test apparatuses (-) include: flip-flops () each provided with first input terminal SI, second input terminal D, mode terminal SE that accepts a mode signal indicating either a first mode or a second mode, clock terminal CK that accepts a clock signal, and output terminal Q, the flip-flops () selecting first input terminal SI when the mode signal indicates the first mode, selecting second input terminal D when the mode signal indicates the second mode, and holding information being received by the input terminal that was selected based on the mode signal in synchronization with the clock signal and supplying as output from output terminal Q; and hold unitthat holds a set value and that provides the set value to first input terminal SI.

Semiconductor testing device, semiconductor device, and testing method

A plurality of semiconductor chips are juxtaposed, each having an electromagnetic induction coil disposed thereon. A signal is transmitted by way of electromagnetic induction between the electromagnetic induction coils disposed on a pair of adjacent semiconductor chips.

Semiconductor device

A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling.

An integrated circuit comprises plural superconducting circuit blocks connected through superconducting wiring strips, and each superconducting circuit block includes at least one superconducting logic circuit, constant input/output circuits connected between the input/output nodes of the circuit block and the superconducting logic circuit; parameters of the constant input/output circuits are regulated such that statically flow-in/flow-out current is approximately equal to zero at the input/output nodes of the superconducting logic circuit, whereby the superconducting logic circuit operates at the optimum operating point after the integration.

Growing community of inventors

Tokyo, Japan

Yoshio Kameda