Nichia Corporation

Sh Materials Co., Ltd.

Yoshio Ichihara

Takeo Kurimoto

Kenji Ozeki

Shimpei Sasaoka

Atsushi Kojima

Chinami Nakai

Mitsuhiro Isono

Kenta Mitsuyama

Kazuaki Sakai

Katsuyuki Doumae

A light-emitting device includes a resin package including a plurality of recessed portions, a plurality of light-emitting elements, each disposed in the corresponding one of the plurality of recessed portions, a plurality of reflective members, and a mold resin portion including a first lens portion, a second lens portion, and a third lens portion. In the plan view, a maximum width of the first lens portion is less than a maximum width of an inner upper surface of the corresponding one of the plurality of recessed portions, a maximum width of the second lens portion is less than a maximum width of an inner upper surface of the corresponding one of the plurality of recessed portions, and a maximum width of the third lens portion is less than a maximum width of an inner upper surface of the corresponding one of the plurality of recessed portions.

Light-emitting device

A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.

Light emitting device

A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

Light-emitting device and method for manufacturing light-emitting device

Alight emitting device includes a package, alight emitting element, and a light-transmissive encapsulant. The package has a top surface and a recessed portion formed with an opening at the top surface. The light emitting element is located on a bottom surface of the recessed portion. The light-transmissive encapsulant is supplied in the recessed portion. The package is provided with a groove formed in the top surface and surrounding the opening. A surface of the groove includes depressed portions and projecting portions. The encapsulant covers at least a part of the surface of the groove, and a portion of the encapsulant that covers the surface of the groove includes a surface irregularity.

A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surfaces are exposed from the resin molding at the lower surface of the resin molding. The first and second lower exposed surfaces are spaced apart from each other with the resin molding being interposed therebetween. The upper exposed surface is exposed from the resin molding at a bottom surface of the recess of the resin molding. In a plan view, the upper exposed surface includes a concave portion in a region corresponding to a region between the first and second lower exposed surfaces, with the concave portion being filled with the resin molding.

Lead frame for light emitting device, and lead frame member for light emitting device

A lead frame for a light emitting device includes a plurality of unit regions and a plurality of suspension pins. Each of the unit regions each includes first to third leads. The suspension pins defines substantially rectangular frames each surrounding a corresponding one of the unit regions. The suspension pins link adjacent ones of the unit regions. In each of the unit regions, the first lead is disposed near a first corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a first extension, the second lead is disposed near a second corner of the substantially rectangular frame and linked to the substantially rectangular frame only via a second extension, and the third lead includes at least two third extensions respectively linked to opposing sides of the substantially rectangular frame.

A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding.

A lead frame, as one product unit in a multi-row lead frame sharing a partition frame among other lead frames, has a non-mirrorsymmetric pad region and at least one terminal region arranged inside and held to a rectangular outer frame region, which is a part of the partition frame and forms a boundary of the lead frame as a product unit, via respective suspension leads. Only two suspension leads hold the non-mirrorsymmetric pad region to the outer frame region as extending from opposite sides of the outer frame region to the non-mirrorsymmetric pad region, respectively. This structure decreases stress resulting from holding of the non-mirrorsymmetric pad region to the outer frame region and thus can prevent the outer frame region from deformation without widened connecting bars or dambars, which form the outer frame region.

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Anan, Japan

Yoshio Ichihara