Renesas Technology Corp.

Hitachi Ulsi Systems Co., Ltd.

Renesas Electronics Corporation

Yoshio Fukayama

Masashi Sahara

Kazuhisa Higuchi

Taku Kanaoka

Koji Fujishima

Yutaro Ebata

Masato Takahashi

Kentaro Yamada

Tatsuyuki Konagaya

Takeshi Katoh

Masaki Sakashita

Koichiro Takei

Yasuhiro Obara

Yuji Takahashi

Tsuyoshi Kachi

Yoshiyuki Miyamoto

Toshihiro Nakajima

Daisuke Ono

Tatsuhiko Miura

Kazuyuki Tokorozuki

Katsuhiro Mitsui

Kazuya Sekiguchi

Tomokuni Chino

A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. To this end, in a region where an occupation rate of wiring is smaller than those in other regions, a dummy wiring is provided. On the contrary, when the occupation rate of wiring is larger than in other regions, slits are formed in the wiring to control the wiring occupation rate. In the respective wirings layers, the shapes, sizes and intervals of wirings below the respective electrode pads are made similar or equal to one another.

Semiconductor device and a method of manufacturing the same

Provided is a manufacturing method of a semiconductor device wherein the generation of voids is prevented in aluminum-based electrodes or the like. The method is suitable for manufacturing a semiconductor device adapted for vehicles, which is required to have a high reliability. However, it is very difficult that power semiconductor devices such as power MOSFETs, in particular, trench gate type power MOS devices are formed without having any void since the thickness of aluminum-based electrodes thereof is as large as about 3500 to 5500 nm (2.5 &#x3bc;m or more). In the present invention, a method is provided wherein at the time of forming an aluminum-based electrode metal film positioned over a wafer and having a thickness of 2.5 &#x3bc;m or more over a highland/lowland-repeated region in a line and space form by sputtering, the temperature of the wafer is set to 400&#xb0; C. or higher and lower than 500&#xb0; C.

Semiconductor device with pads overlapping wiring layers including dummy wiring

For improving the reliability of a semiconductor device having a stacked structure of a polycrystalline silicon film and a tungsten silicide film, the device is manufactured by forming a polycrystalline silicon film, a tungsten silicide film and an insulating film successively over a gate insulating film disposed over the main surface of a semiconductor substrate, and patterning them to form a gate electrode having a stacked structure consisting of the polycrystalline silicon film and tungsten silicide film. The polycrystalline silicon film has two regions, one region formed by an impurity-doped polycrystalline silicon and the other one formed by non-doped polycrystalline silicon. The tungsten silicide film is deposited so that the resistivity of it upon film formation would exceed 1000 &#x3bc;&#x3a9;cm.

Method of manufacturing a semiconductor device

The invention intends to provide a manufacturing method of a semiconductor integrated circuit device, which can detect an off-specification faulty wafer in real time. An abnormality detection server stores apparatus log data outputted from semiconductor manufacturing apparatus that processes a semiconductor wafer in an apparatus log data memory. Thereafter, in a lot end signal receiver, when a lot end signal outputted from the semiconductor manufacturing apparatus is received, an abnormal data detector, after referencing an abnormality detection condition setting file stored in a first detection condition memory, based on the referenced content, judges whether there are abnormal data in the apparatus log data stored in the apparatus log data memory or not. Upon detecting an abnormality, a detection result is outputted to an engineer PC and an operator terminal unit.

Manufacturing method of semiconductor integrated circuit device

Growing community of inventors

Ichinomiya, Japan

Yoshio Fukayama