Mitsubishi Denki Kabushiki Kaisha

New Japan Radio Co., Ltd.

Mitsubishi Electric Corporation

Yoshio Fujii

Yoshiyuki Nakaki

Tatsuya Fukami

Kazuhiko Tsutsumi

Takashi Tokunaga

Yuji Kawano

Kazuo Hashima

Hiroshi Watanabe

Motohisa Taguchi

Shuhei Nakata

Tsuyoshi Kawakami

Yukari Toide

Shigehisa Suzuki

Koji Shindo

Yoshinobu Maeda

Shinji Hara

Akihiko Furukawa

Kohei Ebihara

Hiroshi Kobayashi

Hideki Muto

Shinji Tanabe

Hiroshi Shibata

Sunao Aya

Yuji Ebiike

Yoshinori Yokoyama

Takahiro Nakatani

Jun Yamashita

Hisatoshi Hata

Eisuke Mori

Yuzou Ohdoi

Hiroshi Fukumoto

Shinpei Ogawa

Hiromoto Inoue

Yuya Ohashi

Kohei Shirokura

Takaski Tokunaga

One embodiment provides a semiconductor device having a first chip for lowering an input voltage and a second chip for performing signal processing, mounted on a die pad. Lead terminals are divided into a first lead row and a second lead row. The first lead row are connected with the first chip, the first chip are connected with the second chip or the second lead row, and the second chip are connected with the second lead row. A distance between the lead terminals of the first lead row is set longer than a distance between the lead terminals of the second lead row, and a sealing resin is provided to fill at least between the lead terminals of the first lead row.

Semiconductor device

There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.

Mounting structure of electronic components provided with heat sink

A circuit package having an inner lead, an outer lead and a circuit element is provided, in which the circuit element is connected a first surface of the inner lead. The circuit package has a first molded resin portion and second molded resin portions. The first molded resin portion is formed from a second surface, opposite to the first surface, of the inner lead toward the first surface inner lead embedding the inner lead and the circuit element. And the second molded resin portions are formed on side portions of the outer lead excluding the first and second surfaces of the outer lead.

Lead built-in type circuit package and method for producing same

An aluminum material can be used on a surface of the electrode of a semiconductor element, this aluminum layer need not be formed thick unnecessarily, a copper wire is bonded strongly to the semiconductor element irrespective of a diameter of the wire, and high heat resistance can be achieved. Silicon carbide (SiC) is used as a substrate of the semiconductor element, the titanium layerand the aluminum layerare formed as the electrodeon the silicon carbide substrate, and by a ball bonding or a wedge bonding of the copper wireto the aluminum layerof the electrodewhile applying ultrasonic wave, the copper-aluminum compound layer(AlCu, AlCu or the like) is formed between the copper wireand the titanium layer

Semiconductor device and production method thereof

A semiconductor device having high breakdown voltage and high reliability without forming an embedded injection layer with high position accuracy. The semiconductor device includes a base as an active area of a second conductivity type formed on a surface layer of a semiconductor layer of a first conductivity type to constitute a semiconductor element; guard rings as a plurality of first impurity regions of the second conductivity type formed on the surface layer of the semiconductor layer spaced apart from each other to respectively surround the base in plan view; and an embedded injection layer as a second impurity region of the second conductivity type embedded in the surface layer of the semiconductor layer to connect at least two bottom portions of the plurality of guard rings.

A semiconductor device capable of suppressing generation of a high electric field and preventing a dielectric breakdown from occurring, and a method of manufacturing the same. The method of manufacturing a semiconductor device includes (a) preparing an n+ substrate to be a ground constituted by a silicon carbide semiconductor of a first conductivity type, (b) forming a recess structure surrounding an element region on the n+ substrate by using a resist pattern, and (d) forming a guard ring injection layer to be an impurity layer of a second conductivity type in a recess bottom surface and a recess side surface in the recess structure by impurity injection through the resist pattern, and a corner portion of the recess structure is covered with the impurity layer.

Method of manufacturing semiconductor device

An upper sealing ring and a lower sealing ring are adhered by sealing solder. The width of tip end of sealing projection is narrower than the width of the lower sealing ring. Therefore, the sealing solder is placed on lower sealing ring and on the side surface of upper sealing ring. Further, an upper connection pad and a lower connection pad are adhered by connecting solder. The width of a tip end of a connection projection is narrower than the width of lower connection pad. Therefore, the connecting solder is placed on the lower connection pad and on the side surface of upper connection pad. Thus, a package is provided, which attains satisfactory electrical connection and hermetic seal after solder joint of the upper and lower substrates.

Package and electronic apparatus using the same

A thermal infrared sensor device includes a substrate having a concave portion, a temperature detecting portion connected to the substrate via a supporting leg held at an upper portion of a space within the concave portion, an infrared reflecting film covering at least a portion of the supporting leg without being thermally connected to the temperature detecting portion, and an absorbing hood portion held opposite the infrared reflecting film and thermally connected to the temperature detecting portion, without being thermally connected to the infrared reflecting film, and extending laterally, in a plate shape, covering at least a portion of the infrared reflecting film.

Thermal infrared sensor device and thermal infrared sensor array

A method for magnetically recording/reproducing comprising recording an information signal by forming a pattern of a soft magnetic material in a magnetic recording medium; providing a magnetoeletric converting element in a place neighboring a face of forming the pattern of the magnetic recording medium on which the pattern is formed, applying a magnetic field to the pattern; and reproducing the information by detecting a variation of the magnetic field caused by the pattern of the soft magnetic material of the magnetic recording medium while relatively moving the magnetoelectric converting element and the magnetic recording medium.

Magnetic recording medium

A recording/reproduction method for recording or reproducing information using the magneto-optical recording medium, the magneto-optical recording medium comprising a first magnetic layer comprising a rare earth-transition metal alloy or a ferromagnetic material containing a magnetic transition metal, a second magnetic layer comprising a rare earth-transition metal alloy, a third magnetic layer comprising a rare earth-transition metal alloy, a fourth magnetic layer comprising a rare earth-transition metal alloy, a fifth magnetic layer comprising a rare earth-transition metal alloy, and a sixth magnetic layer comprising a rare earth-transition metal alloy, the second to sixth magnetic layers being stacked in this order on the first magnetic layer, adjacent layers of the second to sixth magnetic layers being coupled by an exchange force thereof.

Overwritable, high-density magneto-optical recording medium and

A method for magnetically recording/reproducing comprising recording an information signal by forming a pattern of a soft magnetic material in a magnetic recording medium; providing a magnetoeletric converting element a place neighboring a face of forming the pattern of the magnetic recording medium on which the pattern formed; applying a magnetic field to the pattern; and reproducing the information by detecting a variation of the magnetic field caused by the pattern of the soft magnetic material of the magnetic recording medium while relatively moving the magnetoelectric converting element and the magnetic recording medium.

Magetic recording/reproducing method, magnetic reproducing apparatus

A magneto-optical recording medium wherein an initializing layer is covered with a resin layer for dissipating heat from the initializing layer thereby to prevent signal degradation at high recording power and thus excellent in record/reproduce repetition times, and the initializing layer is compositionally modulated thereby to broaden allowable ranges for the recording/reproducing light intensity and for the external magnetic field, besides the composition of a first or a second magnetic layer is controlled thereby to enhance recording sensitivity, and the exchange-coupling force between the first and second magnetic layers or the magnetic field strengthe to reverse the magnetization of the first magnetic layer is controlled thereby to enhance the recording/reproducing characteristics.

Magneto-optical recording medium and method of manufacturing the same

A magneto-optical recording medium wherein an initializing layer is covered with a resin layer for dissipating heat from the initializing layer thereby to prevent signal degradation at high recording power and thus excellent in-record/reproduce repetition times, and the initializing layer is compositionally modulated thereby to broaden allowable ranges for the recording/reproducing light intensity and for the external magnetic field, besides the composition of a first or a second magnetic layer is controlled thereby to enhance recording sensitivity, and the exchange-coupling force between the first and second magnetic layers or the magnetic field strengthe to reverse the magnetization of the first magnetic layer is controlled thereby to enhance the recording/reproducing characteristics.

A magneto-optical recording medium allowing both direct overwriting by light power modulation and superresolutive reproduction, and a recording/reproduction method therefor are provided. The magneto-optical recording medium includes six magnetic layers of which adjacent layers are coupled by an exchange force thereof, the first magnetic layer being made of a rare earth-transition metal alloy or a ferromagnetic material containing a magnetic transition metal, the second to sixth magnetic layers being each composed of a rare earth-transition metal alloy. Each of the magnetic layers has a predetermined Curie temperature, and the respective transition metal sub-lattice magnetization directions of the first to third magnetic layers (including the magnetization direction of the first layer) are aligned in one direction at room temperature while at the same time those of the fourth to sixth magnetic layers are aligned in one direction at room temperature. In the recording/reproduction method there are applied external magnetic fields of the same direction for recording and for reproduction, respectively.

A magnetic thin film memory wherein the memory is composed of magnetic thin films with a layer of a higher coercive force and a layer of a lower coercive force via a nonmagnetic layer laminated repetitively, or magnetic thin films having the easy magnetization axis which lies between the perpendicular and the horizontal directions of the magnetic thin film, and information is recorded on the layer of a lower coercive force, or information is recorded by changing the direction of the magnetization by means of a magnetic field applied by two recording lines which cross the magnetic thin film, thereby to obtain a sufficient amplitude of reproduction signal even when the size of the memory is reduced.

Growing community of inventors

Amagasaki, Japan

Yoshio Fujii