Sony Chemicals Corporation

Yoshio Arimitsu

Yutaka Kaneda

A semiconductor element mounting interposer is produced by (A) forming a conducting circuit that comprises motherboard connecting electrodes,and plated leads,on an insulating base film,; (B) forming a patterning resin layer,over the conducting circuit,; (C) etching patterning resin layer,so as to expose the motherboard connecting electrodes,and plated leads,; (D) masking plated leads,with an electroplating resist layer,; (E) depositing an electroplated metal layer,over the exposed motherboard connecting electrodes,; (F) removing the electroplating resist layer,; (G) removing the exposed plated leads,through etching; and (H) where the patterning resin layer,is a polyimide precursor layer, bringing about complete imidation of the polyimide precursor layer.

Growing community of inventors

Kanuma, Japan

Yoshio Arimitsu