Hitachi, Ltd.

Aue Institute, Ltd.

Aue Co. Research Center

Yoshio Adachi

Gen Murakami

Akira Suzuki

Keizo Otsuki

Hideki Kosaka

Hidetoshi Mochizuki

An opening type bone conduction earphone which eliminates headband and has a compact and simple structure comprising a magnetic body, which has an aeration hole, which is able to communicate with the outside world when wearing, at the center part of the axial direction, at least one or more dampers provided at the outer circumference of the magnetic body, and a coil bobbin, which is provided at the outer circumference of the magnetic body, accommodates the damper within a trunk part, and in which a coil is wound at the outer circumference of the trunk part, is provided.

Opening type bone conduction earphone

A battery holder which allows the battery to be installed or removed easily and accurately has a fulcrum that is convex upward formed near the center portion of the bottom surface of the battery holder base. A battery mounting frame has a retainer to immobilize one side of the battery and a frame that secures an electrode and the battery has a retainer and a removing flange to immobilize the other side of the battery. To install the battery, one side of the battery is forced against the spring force of the negative contact while the other side of the battery is inserted between the bottom surface and the retainer. The battery rotates around the fulcrum and is installed in the battery container by a single touch of a finger. As the removing flange is pressed, the installed battery rotates around the fulcrum to allow one side of the battery to escape from the battery container, and ride over the retainer toward the upper side, to allow the battery to be lifted out.

Battery holder

A method of assembling a shielded circuit of electronic components and loading them directly into a shell without arranging electronic components on a board. A hybridized electronic circuit, for example a rectifier circuit is made with a bottom shell formed from a transparent plastic, into which is loaded an electronic part. The bottom shell has a connector section as well as a slot which joins the terminals of the electronic components to a top shell also formed from the same plastic, and the various electronic components; the slots in the bottom shell is such that after the electronic component terminals are intersected they can be positioned; then after the electronic components are loaded, the top shell is placed as a cover, and the intersecting terminals as well as the electronic components are ultrasonically sealed at the same time.

Electronic circuit and a method for fabricating the electronic circuit

A new and improved electronic circuit and a method of producing the same is provided in which at least one electronic element is ultrasonically welded to a printed circuit board to create the electronic circuit. Proper alignment between terminals of a conductive circuit pattern on the circuit board and terminal units on the connecting surface of the electronic element is ensured by a variety of techniques: (i) small protuberances on the terminal units, (ii) raised sections on the bottom surface of the terminal units placed to engage indented portions of the board, and (iii) corresponding posts (on the electronic elements) and holes (formed on the circuit board). The ultrasonic welding of the element to the printed circuit board is typically conducted at a frequency range between 25-30 megahertz which produces a vibration which grinds the terminal units of the electronic element to the terminals of the circuit pattern while also welding the element and circuit board together. Electronic circuits formed in accordance with the inventive concept disclosed herein can be comprised of stacked or interlocking combinations of weldable electronic elements. Such structures can improve rigidity and vary spacial relationships of electronic circuits.

Circuit elements that are ultrasonically welded together

A new and improved electronic circuit connector and method of producing the same is provided by forming a groove on a surface of a first section of ultrasonically weldable material, inserting an elongated contact partially within the groove whereby one end of the contact protrudes out from an end of the connector, overlaying an elongated lead wire on the contact within the groove whereby the lead wire also extends beyond the connector boundary but in an opposite direction of the protruding end of the contact, fitting a second section of ultrasonically weldable material on top of the first section whereby the second section includes a protrusion shaped to interconnect with the groove of the first section, and ultrasonically welding the first and second sections together. Engaging means may be employed on the groove and corresponding protrusion to facilitate alignment of the first and second sections of material. Other embodiments of the present invention enable fabrication of multiple lead connectors and multi-layered connectors.

Electronic circuit connectors and method of manufacturing the same

This invention relates to a lead frame which is applied to a resin-molded semiconductor device. According to the lead frame of this invention, a quadrangular tab for supporting a semiconductor pellet is supported by four tab leads which extend along diagonal lines of the tab.

Lead frame and semiconductor device employing the same with improved

A logic circuit in which a first switching means controlled by a first clock pulse signal and a second switching means controlled by a second clock pulse signal are connected in series with each other between the terminals of a first and a second power source, the first and the second clock pulse signals being out of phase from each other, in which an external signal having three levels is applied as an input to the junction point of the first and second switching means, the three-level signal has a first level, i.e. the voltage of the first power source, a second level, i.e. the voltage of the second power source, and an open level, and in which an output is delivered at the junction point. In the logic circuit, when the external input is at the first or the second level, an output corresponding to the input is delivered irrespective of the clock pulses; and when the external input is at the open level, the first level is delivered on the arrival of the first clock pulse while the second level is delivered on the arrival of the second clock pulse, whereby the three levels externally applied can be identified.

FET Logic circuit for the detection of a three level input signal

A system for driving a bipolar stepping motor by a pair of pulse driving currents wherein an output level of a control circuit is selected depending on one of the pulse drive currents applied just prior to the stoppage of the motor by a reset signal, switching of a set of signal transmitting paths for connecting between a reference signal generating circuit and a motor drive circuit is selected depending on an output level of the control circuit, that one of a pair of reference signals produced by the reference signal generating circuit during the operation of the motor which first appears after the release of the stop causes production of the other of the pulse drive currents by the selected path, and a predetermined time period after the release of the stop the pulse drive current of opposite polarity to that of the pulse drive current being applied to the motor which is just about to stop is applied to the motor to positively re-start the operation of the motor at a predetermined time.

Growing community of inventors

Kodaira, Japan

Yoshio Adachi