Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Yoshinori Wada

Hiroyuki Otani

Hidenobu Nishikawa

Kazuto Nishida

Yoshio Maruyama

Osamu Yamazaki

Shinji Kadoriku

Osamu Hikita

Koichi Kumagai

Daisuke Nagano

Shinji Kanayama

Kazuhiro Mori

Mikiya Nakata

Kazushi Higashi

Hiroyuki Naka

Hidenori Miyakawa

Makoto Imanishi

Takahiro Yonezawa

Tamao Kojima

Akira Isomi

Hiroshi Yamauchi

Daisuke Tabata

Yoshifumi Kitayama

Takashi Akiguchi

Masatoshi Miyasaka

Kazutaka Nishikawa

Teruki Edahiro

Yasuyuki Sato

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component mounting method and apparatus

A sorting member with an optimized surface shape is adopted to pressurize a mixture heated on the sorting member to allow a melted resin mixed in the mixture to adhere to the sorting member to sort the resin from an unmelted resin. Thus, resin materials are sorted and recovered from unwanted home electric appliances and the like at a high purity.

Method of sorting resin

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Electronic component unit

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.

Electronic parts mounting method and device therefor

A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Method of manufacturing article having electronic circuit

An IC chip (,) can be provided to a pre-mount process while being held on a tape-shaped supporting member (,), without being taken out of the tape-shaped supporting member (,).

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

The present invention is a part retainer for housing and retaining various electronic and mechanical parts wherein a retaining unit has an engaging piece that stably stops at both a position at which it protrudes toward the opening of a part housing space and a position at which it withdraws, and which can move between these two positions under a specified or more amount of force, and wherein when protruding toward the opening, the engaging piece prevents the part housed in the housing space from falling out.

Part retainer for holding a part

Component mounting board, process for producing the board, and process

Growing community of inventors

Suita, Japan

Yoshinori Wada