Mitsubishi Electric Corporation

Yoshinori Tsuyama

Jun Nishihara

Kenji Harauchi

Fuminori Sameshima

Hiroshi Otsuka

Mitsuhiro Shimozawa

Hiroyuki Nonomura

Hifumi Noto

Yuichi Fujimoto

Yoshinori Yasunaga

A high frequency module improved in heat dissipation performance includes: a dielectric multilayer substrate including a ground layer and a high frequency electronic component mounted thereon while being in contact with the ground layer, the high frequency electronic component including a heat generating portion; and a cutoff block formed of an upstanding wall portion and a cover portion covering the upstanding wall portion, the cutoff block housing the high frequency electronic component and including a hollow portion having a cutoff characteristic at a frequency of a high frequency signal used by the high frequency electronic component, and the upstanding wall portion of the cutoff block being in contact with the ground layer of the dielectric multilayer substrate.

High frequency module

A microwave amplifier including: a bias circuit that includes a line having an electrical length of one quarter the wavelength at the frequency configured to be amplified by the microwave amplifier and being connected between the output terminal of an amplifier and a bias voltage source, and a capacitor connected between a terminal where the line is connected to the bias voltage source and a ground that defines the reference potential of the microwave amplifier; and a resonant circuit that includes a resistor and a capacitor connected in series between the ground and the terminal where the line is connected to the bias voltage source.

Microwave amplifier device

Growing community of inventors

Chiyoda-ku, Japan

Yoshinori Tsuyama