Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Daikin Industries, Ltd.

Yoshinori Taniguchi

Yasushi Sugiura

Toyohiko Fujisawa

Keiji Wakita

Yoshitsugu Morita

Peter Cheshire Hupfield

Hiroshi Ueki

Mamoru Tachikawa

Tetsuya Masutani

Don Lee Kleyer

Koji Nakanishi

Tomohiro Yoshida

Masahiko Maeda

Yoshito Ushio

Yasuo Itami

Takeaki Saiki

Makoto Iwai

Manabu Sutoh

Tetsuya Mastutani

A method of producing an organic silicon compound includes a step of reaction of the following: (A) a reactive silane compound represented by General Formula (1) below: RSiY(wherein Ris a monovalent organic group (except for the group represented by Y) or a hydrogen atom; Y indicates a chlorine atom or a group represented by &#x2014;OR; Rindicates a monovalent hydrocarbon group having 1 to 30 carbon atoms; and m is a number in the range of 0 to 3), (B) a halogenated organic compound represented by General Formula (2) below: R&#x2014;X (wherein Rindicates a monovalent organic group; and X is a halogen atom), and (C) metallic magnesium (Mg) in the presence of (D) an organic solvent containing at least one type of ether type compound.

Method of producing an organic silicon compound

A surface treatment composition comprises a polyfluoropolyether silane. The polyfluoropolyether silane and the surface treatment composition are produced by reacting a perfluoropolyether-containing compound and a hydrosilane in the presence of a hydrosilylation catalyst and an isomer reducing agent.

Surface treatment composition, method of producing the surface treatment composition, and surface-treated article

An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.

Organosilicon compound, method for producing thereof, and curable silicone composition containing the same

A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein Rdesignates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates identical or different, substituted or unsubstituted alkylene groups; Rdesignates substituted or unsubstituted monovalent hydrocarbon groups; Rdesignates alkyl groups or hydrogen atoms; 'a' is a positive number that satisfies the following condition: 0=a=3; and 'x', &#x2018;y&#x2019;, and &#x2018;z&#x2019; are positive numbers that satisfy the following conditions: 0&#x3c;x&#x3c;0.1; 0&#x3c;y&#x3c;1; 0=z&#x3c;0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.

Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition

The present invention relates to a compound represented by the following general formula (I): wherein in which

4-hydroxyphenylalkylamine derivative

A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250&#xb0; C.; (B) an organopolysiloxane that at 25&#xb0; C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.

Hot-melt silicone adhesive

A method for producing ketimine structure-containing alkoxysilane comprising reacting amino-functional alkoxysilane with a monocarbonyl compound by heating and azeotropically distilling off the produced water together with the monocarbonyl compound to yield ketimine structure-containing alkoxysilane, characterized by introducing additional monocarbonyl compound at the time of the azeotropic distillation of the produced water together with the monocarbonyl compound.

Method for producing ketimine structure-containing alkoxysilane

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Ichihara, Japan

Yoshinori Taniguchi