Sharp Kabushiki Kaisha Corporation

Shicoh Engineering Co., Ltd.

Yoshinori Tanida

Katsuitsu Nishida

Yoshihiro Sekimoto

Masayuki Ehiro

Kazuya Fujita

Naoki Sekiguchi

Tetsuya Fujimoto

Yoshikazu Ohara

Kiyoharu Shimano

Fujio Tanaka

Kenji Sakai

Tohru Shigeta

Hidetoshi Nishimura

Morimasa Yoshie

A camera module () has an internal space () that abuts a wiring substrate () and is occluded, at least a part of a base material of the wiring substrate () is a porous portion () that is configured of porous ceramic, porous metal, organic fabric, or inorganic fabric and has interconnected air holes, and the internal space () is connected to the outside of the camera module () through the interconnected air holes.

Camera module

A camera apparatus () includes: a first housing () including a lens section (); a second housing () including an image pickup section (); and a connecting section () which connects the first and second housings () and (). During image pickup, a focal length is specified by a contact between a bottom surface of a lens holder () which is exposed in the first housing () and a top surface of a transparent cover section () which is exposed in the second housing (). This allows a realization of a camera apparatus in which a focal length is specified with high accuracy.

Camera apparatus and electronic device provided with the same

An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.

Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus

In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image pickup element as a semiconductor element is covered with a cover, and a holder as a lid is placed over the cover.

Semiconductor device module and manufacturing method of semiconductor device module

A camera module includes a solid-state imaging device; a lens unit having a lens for guiding light to the solid-state imaging device; a lens holder for holding the solid-state imaging device, the lens holder including a lens coupling section provided for adjusting the position of the lens, such that a distance between the lens and the solid-state imaging device becomes a prescribed focusing distance; and a shield cap for covering the lens coupling section and the lens unit so as to allow the light to be guided to the lens in the lens unit.

Solid-state imaging module with frictionally attached shield cap

There are provided a first casingA that has a photosensor sectionfor capturing an image, a second casingB that has a lens sectionfor projecting the image of a subject onto the photosensor sectionof the first casingA and a connection sectionC that foldably connects the first casingA with the second casingB. The photosensor sectionand the lens sectionare arranged so that the photosensor sectionand the lens sectionare superposed on each other in a state in which the first casingA and the second casingB are folded together. With this arrangement, the folding type camera device and the folding type portable telephone equipped with this device can be reduced in thickness.

Growing community of inventors

Tenri, Japan

Yoshinori Tanida