Shin-etsu Chemical Co., Ltd.

Niigata University

Yoshinori Takamatsu

Takeshi Fukuda

Masanao Kamei

Kazuaki Sumita

Yoshihiro Tsutsumi

Hiroyuki Iguchi

Yuki Kudo

Takuya Abe

Hiroomi Iyoku

Atsushi Tsuura

Tetsuo Oka

A low-dielectric heat dissipation film composition contains: (A) a maleimide resin composition containing (A1) a maleimide resin containing at least two or more maleimide groups per molecule and (A2) a polymerization initiator; and (B) boron nitride particles. The component (A1) has a maleimide equivalent of not more than 0.1 mol/100 g, and a cured material of the component (A) has a relative dielectric constant of 3.5 or less at a frequency of 10 GHz. Thus, the present invention provides a film composition for forming a film having low dielectric constant and high heat dissipation.

Low-dielectric heat dissipation film composition and low-dielectric heat dissipation film

A method for preparing a compact of resin compound comprising the following steps (a) to (c):

Method for preparing compact of resin compound having anisotropy

Provided are a thermally conductive resin sheet having light transmission, including a cured product of a fiber cloth-containing thermally conductive resin composition prepared by thermally curing or semi-curing a laminate composed of five or more sheets of a prepreg made by impregnating a fiber cloth made of thermally conductive fibers as warp and white or transparent fibers as weft with a transparent curable resin composition, the cured product having a cut surface vertical to a length direction of the thermally conductive fibers, and a method for producing the thermally conductive resin sheet.

Thermally conductive resin sheet having light transmission and method for producing the same

A method for producing a hydrosilyl group-containing organic silicon resin of formula (6) in a solid form, wherein after formulae (1) to (3) are hydrolyzed in the presence of an acid catalyst, hydrolysis is carried out by adding hydrosilyl group-containing organic silicon compounds of formulae (4) and (5), followed by neutralization by a base catalyst with the amount thereof being more than a molar equivalent of the acid catalyst, and then by condensation. By so doing, deactivation amount of the hydrosilyl group can be reduced, so that the method for producing the hydrosilyl group-containing organic silicon resin, which is in a solid form without a solvent and to which a hydrosilyl group can be introduced quantitatively and in a large quantity, is provided,RSiOSiR&#x2003;&#x2003;(1)RSiX&#x2003;&#x2003;(2)SiX&#x2003;&#x2003;(3)HRSiOSiRH&#x2003;&#x2003;(4)HRSiX&#x2003;&#x2003;(5)(RSiO)(HRSiO)(SiO)(RSiO)&#x2003;&#x2003;(6).

Method for producing hydrosilyl group-containing organic silicon resin

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Annaka, Japan

Yoshinori Takamatsu