Fuji Electric Co., Ltd.

Yoshinori Oda

Yoshinori Uezato

Manabu Watanabe

Atsushi Maruyama

A semiconductor device including a semiconductor chip disposed on a substrate having a conductive pattern, an insulating plate and a metal plate that are sequentially formed and respectively have the thicknesses of T, Tand T. The metal plate has a plurality of depressions formed on a rear surface thereof. In a side view, a first edge face, which is an edge face of the conductive pattern, is at a first distance away from a second edge face that is an edge face of the metal plate, and a third edge face, which is an edge face of the semiconductor chip, is at a second distance away from the second edge face. Each depression is located within a depression formation distance from the first edge face, where: 0&#x3c;depression formation distance&#x2264;(0.9&#xd7;T/first distance), and/or (1.1&#xd7;T/first distance)&#x2264;depression formation distance&#x3c;second distance.

Semiconductor device with a substrate having depressions formed thereon

A lead frame for a resin-molded semiconductor device is provided with die pads for separately mounting chips of power elements and a control IC thereon; terminal leads arranged in a row at one side and including leads for the die pads, and a main circuit, a control power supply and signal circuit separated from the die pads; and a dam bar connecting the terminal leads. In the main circuit terminals and control power supply terminals, a plurality of leads is formed and drawn in advance. After the lead frame is set in a mold die and is resin-molded, certain leads that are not used as the terminal leads are selected among the plurality of the leads, and the certain leads are cut and removed together with the dam bar.

Lead frame for resin-molded semiconductor device

An intelligent power module (IPM) is formed of an inverter having power elements, a predriver for driving the inverter, and a protect circuit, and all these components are integrated into the same package. A shunt resistor is provided at an output of the inverter so that an end-to-end voltage of the shunt resistor can be output to an external device. This configuration enables an output current from an inverter apparatus incorporating the IPM to be detected without using a current transformer that requires a large installation space. In addition, the module terminals of the IPM and the terminal blocks of the inverter apparatus are integrated together to eliminate the need for wire rods and set screws for connections which are used to connect the module terminals and the terminal blocks together.

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Matsumoto, Japan

Yoshinori Oda