Shell Oil Comapny

Mitsubishi Chemical Corporation

Yoshinori Nakanishi

Yasuyuki Murata

Norio Tohriiwa

Isako Konishi

Ryohei Tanaka

Takuya Kurio

Yoshinori Hara

Yoshinobu Ohnuma

Atsuhito Hayakawa

Mareki Miura

Tetsuro Imura

Hiroko Inagaki

Mitsukazu Ochi

Yasuyki Murata

To provide an epoxy resin composition which can provide a cured resin which is excellent in weatherability and electric properties, and which is useful as a resin for coatings, an encapsulant, a casting material, an electric insulator, etc. An epoxy resin composition which contains a hydrogenated epoxy resin obtained by hydrogenation of an aromatic epoxy resin, wherein the hydrogenated epoxy resin has a hydrogenation ratio in an aromatic ring of not less than 85%, a loss ratio of epoxy groups of not more than 20%, and a total chlorine content of not more than 0.3% by weight.

Epoxy resin composition

The process for producing a modified epoxy resin comprises reacting (a) an epoxy resin having at least two epoxy groups per one molecule, and (b) a specific active ester group-containing compound having at least two aromatic ring-bonded active ester groups per one molecule, in proportions such that the amount of the active ester groups in the active ester group-containing compound is from about 0.05 to about 0.95 mol per mole of the epoxy group in the epoxy resin, and the modified epoxy obtained by this process, and a composition of the epoxy resin and a curing agent are encompassed.

Process for producing modified epoxy resin, modified epoxy resin

The present invention relates to a liquid resin composition comprising (1) a liquid epoxy resin, (2) a particular ester curing agent, and (3) a curing accelerator. This epoxy resin composition can provide a cured resin with excellent heat resistance and water resistance, which is particularly useful for encapsulation, casting and adhesion.

Liquid epoxy resin composition

To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d):

Epoxy resin composition for encapsulation of semiconductors

The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant. ##STR1##

Halogenated epoxy resin, production of said resin, flame retardant, and

The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

Epoxy resin composition for semiconductor encapsulation

A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.

Modified liquid epoxy resin composition

An epoxy resin composition is provided comprising a biphenol-type epoxy resin and a polyhydric phenol resin curing agent derived from a polyhydric phenol compound having 2 or more phenolic hydroxyl groups attached at adjacent positions on the aromatic ring. A cured product with excellent stability and strength at high temperatures can be obtained useful as adhesives, castings, sealing materials, moldings, and laminates.

Epoxy resin composition containing novolac with adjacent hydroxyl groups

An electrical encapsulation formulation is provided comprising a diglycidyl ether of a 4,4'-dihydroxybiphenyl, a trisphenolic curing agent, a cure accelerator and an inorganic filler. The composition cures rapidly and exhibits excellent resistance to cracking under high-temperature operation.

A composition is disclosed which comprises the reaction product of a diglycidyl ether of a 4,4'-dihydroxybiphenyl and a polyhydric phenol having an average of 2.3 to 10 hydroxyl groups per molecule. The described epoxy resin is particularly useful in phenolic-cured electrical encapsulation formulations.

An electrical encapsulation composition containing an epoxy resin, a phenolic curing agent and a tris(dialkoxyphenyl)phosphine high cured glass transition temperature and good crack resistance.

Growing community of inventors

Yokkaichi, Japan

Yoshinori Nakanishi