Mitsubishi Gas Chemical Company, Inc.

Yoshinori Mabuchi

Masanobu Sogame

Yoshihiro Kato

Takashi Kobayashi

Chisato Saito

Masayuki Katagiri

Masukazu Hirata

Daisuke Ueyama

Makoto Tsubuku

Sotaro Hiramatsu

Kentaro Nomizu

Keita Tokuzumi

Kenji Arii

Hiroshi Hasegawa

Hideyuki Takahashi

Hiroaki Kobayashi

Takahiro Seki

Hiroyuki Mishima

Tomoo Tsujimoto

Yuuichi Sugano

Seiji Shika

Taketo Ikeno

Mitsuru Ohta

Kazuhiro Otsu

Naoki Kashima

Keiichi Hasebe

Kenj Arii

Noriyuki Kimura

Chihara Nisizawa

A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 &#x3bc;m; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board

A resin composition for a printed wiring board including: 

Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board

The present invention is a cyanate ester compound represented by the following formula (1): 

Cyanate ester compound, curable resin composition containing the same, and hardened product thereof

The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.

Resin composition, prepreg and laminate

A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

Resin composition, and prepreg and laminate using the same

To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.

Resin composition, prepreg, and laminate

A method for efficiently producing a cyanogen halide with suppressed side effects, and a method for producing a high-purity cyanate ester compound at a high yield includes contacting a halogen molecule with an aqueous solution containing hydrogen cyanide and/or a metal cyanide, so that the hydrogen cyanide and/or the metal cyanide is allowed to react with the halogen molecule in the reaction solution to obtain the cyanogen halide, wherein more than 1 mole of the hydrogen cyanide or the metal cyanide is used based on 1 mole of the halogen molecule, and when an amount of substance of an unreacted hydrogen cyanide or an unreacted metal cyanide is defined as mole (A) and an amount of substance of the generated cyanogen halide is defined as mole (B), the reaction is terminated in a state in which (A):(A)+(B) is between 0.00009:1 and 0.2:1.

Method for producing cyanogen-halide, cyanate ester compound and method for producing the same, and resin composition

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound.

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same

An oxygen-absorbing composition comprising (a) a powdery or particulate crosslinked polymer containing carbon-carbon unsaturated bonds and having a high heat resistance and being easy to grind due to crosslinked structure, and (b) a catalyst. The oxygen-absorbing composition can be used in a dry state and can be utilized in an oxygen absorbent package. An oxygen-absorbing multilayered body can be formed from the oxygen-absorbing composition. A sheet or a film oxygen-absorbing multilayered body can be made from the oxygen-absorbing composition.

Oxygen-absorbing component, oxygen absorbent package and oxygen-absorbing multilayered body containing same

Deoxidizing multilayered body and method or manufacturing the same

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Tokyo, Japan

Yoshinori Mabuchi