Kabushiki Kaisha Toshiba

Yoshinori Kamikawa

Tomomi Murayama

Satoshi Ooka

Yuji Nakajima

Masaru Seto

Eiji Hashimoto

Tornomi Murayama

A rectangular heating section is so shaped as to touch the electronic component except corners of the rectangle when the surface of the electronic component does not parallel the heating section. For example, the heating section is formed to be smaller than the electronic component surface, to be a rectangle which is smaller than the electronic component surface and comprises rounded corners, to be an octagon which is smaller than the electronic component surface and is formed by cutting off corners of the rectangle, or to be an octagon which is larger than the electronic component surface and is formed by cutting off corners of the rectangle. A die is prevented from being damaged due to a contact with the heating section of a cooling module at a given point of the die according to a mounting error or a usage state.

Electronic device

A portable information-processing apparatus comprising a housing having a first wall and a second wall opposing the first wall. A first manual operating member is provided on the first wall and exposed. A second manual operating member is provided on the second wall, is exposed, and facing away from the first manual operating member. In the housing there is provided a reinforcing plate for receiving the pressure which is generated when the first manual operating member is operated. The reinforcing member is located between the first and second operating members and supported by the first wall. The first and second manual operating members are supported by the first wall. The reinforcing plate is placed apart from the second manual operating member, forming a gap. The second wall has a projection which abuts on the reinforcing plate.

Portable information-processing apparatus having a manual operation

Connecting pads in pad rows in a signal layer are connected to another signal layer through a plurality of through hole rows each including a plurality of plated through holes that extend through a power source layer. Each of the through hole rows includes a plurality of through holes arranged side by side between each two adjacent pad rows corresponding thereto. These plated through holes each face the space between each two adjacent connecting pads in each corresponding pad row, and are arranged at intervals about twice as long as the intervals between the connecting pads. Each two adjacent through hole rows are located with an offset not smaller than the diameter of each pad in the longitudinal direction of the rows, and the power source layer includes a plurality of clear regions that are cleared of a conductor and penetrated individually by the through holes.

Printed wiring board

A circuit module comprising a circuit board, a function component, and a heat sink. The circuit board has a number of circuit components and a circuit element which generates heat while operating. The function component is secured to the circuit board by screws. The heat sink is connected to the circuit board by the screws, for radiating heat generated by the circuit element.

Electronic apparatus incorporating a circuit module having a heat sink

A portable computer has a base unit with a first expansion connector mounted on a rear wall. The expansion connector is covered by a connector unit. The connector unit includes pivotally mounted upper and lower covers having laterally extending guide portions. The upper and lower covers have a closed position which covers the connector. An external expansion unit has a second expansion connector mounted on a connector mounting surface. A cover opening member projects from the connector mounting surface. When the expansion unit is connected to the portable computer the cover opening member pushes the upper and lower to covers to an open position which uncovers the first expansion connector.

Growing community of inventors

Tokyo, Japan

Yoshinori Kamikawa