Jtekt Corporation

Toyo Kogyo Co., Ltd.

Yoshinori Imoto

Hiroaki Suzuki

Kazushi Numazaki

Takaya Nagahama

Koichi Shiiba

Akira Yamashita

Tsukuo Ishitoya

Chihiro Uchimura

Noritaka Watanabe

Yutaka Inada

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

Bonding method and bonding device for metal member

A heating method includes an oxide film forming step and a heating step. The thickness of an oxide film is set in a first range that includes a first maximal thickness and a second maximal thickness and that is smaller than a second minimal thickness in the relationship with the laser absorption having a periodic profile. The first maximal thickness corresponds to a first maximal value a of the laser absorption. The second maximal thickness corresponds to a second maximal value of the laser absorption. The second minimal thickness corresponds to a second minimal value of the laser absorption, namely the minimal value of the laser absorption that appears between the second maximal value and a third maximal value, or the maximal value of the laser absorption that appears subsequent to the second maximal value.

Method for heating a metal member, method for bonding heated metal members, and apparatus for heating a metal member

A safety valve includes a cylinder having an open end and a plug for closing the open end with a hermetic seal. The interior of the cylinder communicates with a high-pressure gas passage. The cylinder is deformed as a function of gas pressure in the high-pressure gas passage to widen the open end. This allows gas in the high-pressure gas passage to escape and thus prevents the gas pressure from increasing beyond an acceptable level.

Safety valve and electromagnetic valve

A valve device includes a wire channel through which wires are routed from the inside of a gas tank to the outside of the gas tank, and a hermetic connector in which a sealing member is provided around wire pins that constitute part of the wires is provided in the wire channel. In addition, the wire channel has multiple (two) bent portions formed on the outer side of the hermetic connector. When pulling force acts on the wires from the outside, stress concentration portions are formed in the wires at these bent portions.

Valve device

Growing community of inventors

Kariya, Japan

Yoshinori Imoto