Daicel Chemical Industries, Ltd.

Daicel Corporation

Other

Japan Science and Technology Corporation

Yoshinori Funaki

Kiyoharu Tsutsumi

Keizo Inoue

Akira Takaragi

Tatsuya Nakano

Tomoaki Mahiko

Naoko Araki

Shinya Nagano

Jiichiro Hashimoto

Koji Asakawa

Naomi Shida

Yasutaka Ishii

Toru Ushirogouchi

Toshikazu Nakamura

Hiroto Miyake

Takeshi Okino

Takahiro Iwahama

Takeji Hashimoto

Mitsuru Ohno

Kazuo Notsu

Tsukasa Yoshida

Masafumi Harada

Toru Nakai

Tomoko Adachi

Provided is a photocatalytic coating film that can develop excellent photocatalytic activity and exhibit superior adhesion to an adherend surface. The photocatalytic coating film is obtained by applying and drying a photocatalytic coating composition containing at least rod-like or needle-like titanium oxide particles and a binder component so that the photocatalytic coating film contains the titanium oxide particles in a content of 0.5 g/mor more. The photocatalytic coating film contains the titanium oxide particle in a content per unit volume (1 mby 1 &#x3bc;m thick) of less than 3.0 g. The titanium oxide particles preferably have an aspect ratio of 1.5 or more, the aspect ratio specified as the ratio of a long side length to a short side length of particle. The compositional ratio (by weight) of the titanium oxide particles to the binder component in the photocatalytic coating film is preferably from 1:6 to 30:1.

Photocatalytic coating film and method for producing same

Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, Rrepresents hydrogen atom or methyl group; Rrepresents hydrogen atom or an alkyl group; and 'A' represents a linear or branched chain alkylene group having 2 to 20 carbon atoms. 

Cationically polymerizable resin, cationically polymerizable resin composition, and cured products thereof

Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0&#xb0; C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rrepresents hydrogen atom or methyl group; Rto Reach independently represent a hydrocarbon group having 1 to 5 carbon atoms; 'a' is an integer of from 0 to 5; and 'b' is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment. 

Cationically polymerizable resin composition and cured object obtained therefrom

Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 &#xb0; C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description. 

Radical-polymerizable resin, radical-polymerizable resin composition, and cured material thereof

Disclosed is an oxetane-containing vinyl ether compound including one or more aromatic or non-aromatic carbocycles and/or two or more vinyl ether structures, such as a compound of Formula: wherein Ring Zis non-aromatic carbocycle; Ris vinyl group of Formula: wherein each of R, R, and Ris hydrogen or C1-C4 alkyl; Wis single bond or organic group having a valence of (m+1); Xis, for example, hydrocarbon; 'm' and 'q' are each 1 or 2; and &#x201c;p&#x201d; is 0 to 5. Also disclosed is an alicyclic epoxy-containing vinyl ether compound of Formula: wherein Ring Zis non-aromatic carbocycle; Ris vinyl group of Formula: wherein R, Rand Rare each hydrogen or C1-C4 alkyl; Wis single bond or organic group having a valence of (r+1); Rand Rare hydrogen or alkyl; and &#x201c;r&#x201d; and &#x201c;s&#x201d; are 1 or 2.

Vinyl ether compounds and polymerizable compositions

A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hydrocarbon group or R; R, R, Rand Rand are each independently a protected or unprotected carboxyl group, etc.; and Y, Y, Yand Yare each independently a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine derivative represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R, R, Rand Rare each a substituent bound to Ring Z and are each independently a protected or unprotected amino group, etc., dissolved in the organic solvent.

Dielectric films and materials therefor

A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): wherein R, R, R, Rand Rare the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.

Polymer for photoresist and resin compositions therefor

A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y, Y, Yand Yare the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2):wherein Ring Z is a monocyclic or polycyclic aromatic ring; and Rand Rare each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent  

PolymEric compound and resin composition for photoresist

Photoresist polymeric compound and photoresist resin composition

Polymeric compound and resin composition for photoresist

Method for surface modification of molded article of plastic and method for modifying polymer

Compounds for photoresist and resin composition for photoresist

There are disclosed a metal-organic polymer composite structure, particularly a porous metal-organic polymer composite structure, for use as functional materials such as catalysts, and a method for producing the structure. The composite structure is composed of a microphase-separated structure from a block copolymer in which a metalphilic polymer chain and a metalphobic polymer chain are bonded together at each end, and ultrafine metal particles are contained in the metalphilic polymer phase of the microphase-separated structure.

Metal-organic polymer composite structure and production thereof

Growing community of inventors

Himeji, Japan

Yoshinori Funaki